There are few more interesting presentations at ISSCC 2010. One of them is Sony plenary paper:
Challenges of Image-Sensor Development
Tomoyuki Suzuki, Senior Vice-President, Sony, Atsugi, Kanagawa, Japan
...Recently, a 10M pixel CMOS image sensor with high image quality, providing more than 70dB dynamic range, and high-speed read-out of 576M pixels/s (10M pixels at 50 frames/s) has been developed. This sensor can also be operated in a 6M pixel mode at 60 frames/s with a 16:9 aspect
ratio. This imager has been realized using two important technologies: the column ADC, and the back-illuminated structure.
...In the future, the performance of the digital camera is expected to improve tremendously with the evolution of the CMOS image sensor. There are many “key milestones” in this evolution, such as “3D”, “4K×2K”, “global shutter”, and so on.
Forum 4, page 73 is entirely devoted to high-speed imaging technologies (there is a mistake in forum name on the Advanced Program contents page):
Introduction
Johannes Solhusvik, Aptina Imaging, Oslo, Norway
High-Speed CMOS Pixel Physics and Electronics
Boyd Fowler, Fairchild Imaging, Milpitas, CA
High-Speed Imaging with CCDs
Jan Bosiers, DALSA, Eindhoven, The Netherlands
High-Speed CMOS Image Sensor Architectures
Guy Meynants, CMOSIS, Antwerp, Belgium
Column Readout Circuit Design for High-Speed Low-Noise Imaging
Shoji Kawahito, Shizuoka University, Hamamatsu, Japan
3D Range Image Capture Technologies
Makoto Ikeda, University of Tokyo, Tokyo, Japan
High-Speed Digital Image Processing
Levy Gerzberg, Zoran, Sunnyvale, CA
Vision Chip and its Applications to Human Interface, Inspection, Bio/Medical Industry, and Robotics
Masatoshi Ishikawa, University of Tokyo, Tokyo, Japan
High-Speed Analog Interfaces for Imagers
Katsu Nakamura, Analog Devices, Wilmington, MA
High-Speed Digital Interfaces for Imagers
Jean Dassonville, Agilent Technologies, Santa Clara, CA
Dual Integration HDR Mode Non-Linearity Discussion
Electrons and Holes blog referred to an interesting paper from the open-access Sensors magazine discussing the issue of non-linearity in dual-integration HDR mode. This non-linearity is often omitted from the HDR principle explanation, although it can greatly affect the final image quality.
Non-Linearity in Wide Dynamic Range CMOS Image Sensors Utilizing a Partial Charge Transfer Technique
Suhaidi Shafie (1), Shoji Kawahito (2), Izhal Abdul Halin (1) and Wan Zuha Wan Hasan (2)
(1) Department of Electrical and Electronic Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM Serdang, Selangor, Malaysia
(2) Research Institute of Electronics, Shizuoka University, 3-5-1 Johoku, Nakaku, Hamamatsu 432-8011, Japan
The non-linearity is caused by two factors, namely the current diffusion, which has an exponential relation with the potential barrier, and the initial condition of photodiodes in which it shows that the error in the high illumination region increases as the ratio of the long to the short accumulation time raises. Moreover, the increment of the saturation level of photodiodes also increases the error in the high illumination region.
To make the analysis more complete, I'd like to see the influence of pixel to pixel mismatches on this non-linearity and see whether these mismatches make the non-linearity less visible in the final picture. The paper relies on Link Research' SPECTRA simulator - a good demo of the simulator capabilities.
Non-Linearity in Wide Dynamic Range CMOS Image Sensors Utilizing a Partial Charge Transfer Technique
Suhaidi Shafie (1), Shoji Kawahito (2), Izhal Abdul Halin (1) and Wan Zuha Wan Hasan (2)
(1) Department of Electrical and Electronic Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM Serdang, Selangor, Malaysia
(2) Research Institute of Electronics, Shizuoka University, 3-5-1 Johoku, Nakaku, Hamamatsu 432-8011, Japan
The non-linearity is caused by two factors, namely the current diffusion, which has an exponential relation with the potential barrier, and the initial condition of photodiodes in which it shows that the error in the high illumination region increases as the ratio of the long to the short accumulation time raises. Moreover, the increment of the saturation level of photodiodes also increases the error in the high illumination region.
To make the analysis more complete, I'd like to see the influence of pixel to pixel mismatches on this non-linearity and see whether these mismatches make the non-linearity less visible in the final picture. The paper relies on Link Research' SPECTRA simulator - a good demo of the simulator capabilities.
Image Sensors at ISSCC 2010
ISSCC published its Advance 2010 Program with 9-paper session devoted entirely to image sensors. All papers appear quite interesting this year.
Sony brings its 1.75um BSI pixels to perfection with huge full well, high sensitivity, low noise, and very fast, presented in the paper:
A 1/2.3-inch 10.3Mpixel 50 frame/s Back-Illuminated CMOS Image Sensor
H. Wakabayashi, K. Yamaguchi, M. Okano, S. Kuramochi, O. Kumagai, S. Sakane1, M. Ito, M. Hatano, M. Kikuchi, Y. Yamagata, T. Shikanai, K. Koseki, K. Mabuchi, Y. Maruyama, K. Akiyama, E. Miyata, T. Honda, M. Ohashi, T. Nomoto
Sony, Atsugi, Japan
Sony Semiconductor, Nagasaki, Japan
A 1/2.3-inch 10.3Mpixel 50frame/s CMOS image sensor fabricated using a 0.13μm 1P4M CMOS process with back-illumination technology achieves sensitivity of 9890e-/lux·s, random noise of 1.7e- and saturation of 8850e-. The sensor integrates a 10b/12b analog-to-digital converter, an internal PLL and a 10b serial LVDS interface to enable a data-rate up to 576MHz.
Panasonic presents a new idea for its 4K2K sensor. I'm unable to grasp their idea, but it sounds quite different from the most sensor's timing. I hope they explain it better in the paper:
A 2.2/3-inch 4Kx2K CMOS Image Sensor Based on Dual Resolution and Exposure Technique
T. Azuma, T. Imagawa, S. Ugawa, Y. Okada, H. Komobuchi, M. Ishii, S. Kasuga, Y. Kato
Panasonic, Kyoto, Japan
Panasonic, Takatsuki, Japan
A 2.2/3-Inch 4K2K dual resolution and exposure CMOS imager uses motion information to improve the sensitivity by 4 times in comparison to a conventional sensor. The green pixels are read out once every four frames for high sensitivity. Both the red and blue pixels are read out each frame, binned for 2×2 and used for motion compensation.
Toyota and Shizuoka University present a sensor for spatial optical communication. Its hard to say what is special about their system, as some already deployed products have much better speed and range. I hope the paper answers on this:
A CMOS Image Sensor for 10Mb/s 70m-Range LED-Based Spatial Optical Communication
S. Itoh, I. Takai, M. Z. Sarker, M. Hamai, K. Yasutomi, M. Andoh, S. Kawahito
Shizuoka University, Hamamatsu, Japan
Toyota Central R&D Labs, Aichi, Japan
A CMOS image sensor for spatial optical communication is presented. A two-transistor optical communication cell with a depleted photodiode and lateral charge overflow drain improves the light pulse response. A weighed summation of 9-point parallel analog outputs and pulse equalizing technique greatly enhance the bit-rate and communication distance up to 10Mb/s and 70m, respectively.
Samsung and Yonsei University present fast low noise sensor with sigma-delta column-parallel ADC:
A 2.1Mpixel 120frame/s CMOS Image Sensor with Column-Parallel ΔΣ ADC Architecture
Y. Chae, J. Cheon, S. Lim, D. Lee, M. Kwon, K. Yoo, W. Jung, D-H. Lee, S. Ham, G. Han
Yonsei University, Seoul, Korea
Samsung Electronics, Yongin, Korea
A 2.1Mpixel 120frame/s CMOS image sensor with column-parallel ΔΣ ADCs is realized in a 0.13μm CMOS process. Column-parallel ΔΣ ADC architectures improve the conversion speed while reducing the random noise level as well. Inverter-based SC circuits maximize the power efficiency. This sensor achieves a measured noise floor of 1.9e-, while dissipating 180mW.
Another interesting paper from Samsung touts "Pseudo-Multiple Sampling" to achieve very low noise:
A 1.1e- Temporal Noise 1/3.2-inch 8Mpixel CMOS Image Sensor using Pseudo-Multiple Sampling
Y. Lim, K. Koh, K. Kim, H. Yang, J. Kim, Y. Jeong, S. Lee, H. Lee, S-H. Lim, Y. Han, J. Kim,
J. Yun, S. Ham, Y-T. Lee
Samsung Electronics, Yongin, Korea
A pseudo-multiple sampling technique for a low-noise CIS is implemented using a conventional column-parallel single-slope ADC structure with no additional circuitry. It is applied to a 1/3.2-inch 8Mpixel CIS. Measurement results show the technique effectively reduces dark temporal noise from 1.6e- to 1.2e- in 10b ADC mode, and from 1.8e- to 1.1e- in 12b ADC mode.
Shuzuoka University presentas HDR sensor with global shutter:
A 2.7e- Temporal Noise 99.7% Shutter Efficiency 92dB Dynamic Range CMOS Image Sensor with Dual Global Shutter Pixels
K. Yasutomi, S. Itoh, S. Kawahito
Shizuoka University, Hamamatsu, Japan
A dual global shutter CIS with pinned storage diode and floating diffusion memory enables a low noise level of 2.7e- and wide dynamic range of 92dB. Dual doping pinned diodes with a shielding structure attain a high shutter efficiency of 99.7%.
Austrian Institute of Technology presents even wider DR sensor:
A QVGA 143dB Dynamic Range Asynchronous Address-Event PWM Dynamic Image Sensor with Lossless Pixel-Level Video Compression
C. Posch, D. Matolin, R. Wohlgenannt
Austrian Institute of Technology, Vienna, Austria
A 0.18μm CIS contains a QVGA array of autonomous pixels that individually detect illumination changes and communicate new gray levels that are PWM encoded after each detected change, ideally realizing optimal lossless pixel-level video compression. Readout is frame-free 18b parallel AER. SNR of >56dB and intra-scene DRs of 143dB static and 125dB at 30fps equivalent have been achieved.
Sony brings its 1.75um BSI pixels to perfection with huge full well, high sensitivity, low noise, and very fast, presented in the paper:
A 1/2.3-inch 10.3Mpixel 50 frame/s Back-Illuminated CMOS Image Sensor
H. Wakabayashi, K. Yamaguchi, M. Okano, S. Kuramochi, O. Kumagai, S. Sakane1, M. Ito, M. Hatano, M. Kikuchi, Y. Yamagata, T. Shikanai, K. Koseki, K. Mabuchi, Y. Maruyama, K. Akiyama, E. Miyata, T. Honda, M. Ohashi, T. Nomoto
Sony, Atsugi, Japan
Sony Semiconductor, Nagasaki, Japan
A 1/2.3-inch 10.3Mpixel 50frame/s CMOS image sensor fabricated using a 0.13μm 1P4M CMOS process with back-illumination technology achieves sensitivity of 9890e-/lux·s, random noise of 1.7e- and saturation of 8850e-. The sensor integrates a 10b/12b analog-to-digital converter, an internal PLL and a 10b serial LVDS interface to enable a data-rate up to 576MHz.
Panasonic presents a new idea for its 4K2K sensor. I'm unable to grasp their idea, but it sounds quite different from the most sensor's timing. I hope they explain it better in the paper:
A 2.2/3-inch 4Kx2K CMOS Image Sensor Based on Dual Resolution and Exposure Technique
T. Azuma, T. Imagawa, S. Ugawa, Y. Okada, H. Komobuchi, M. Ishii, S. Kasuga, Y. Kato
Panasonic, Kyoto, Japan
Panasonic, Takatsuki, Japan
A 2.2/3-Inch 4K2K dual resolution and exposure CMOS imager uses motion information to improve the sensitivity by 4 times in comparison to a conventional sensor. The green pixels are read out once every four frames for high sensitivity. Both the red and blue pixels are read out each frame, binned for 2×2 and used for motion compensation.
Toyota and Shizuoka University present a sensor for spatial optical communication. Its hard to say what is special about their system, as some already deployed products have much better speed and range. I hope the paper answers on this:
A CMOS Image Sensor for 10Mb/s 70m-Range LED-Based Spatial Optical Communication
S. Itoh, I. Takai, M. Z. Sarker, M. Hamai, K. Yasutomi, M. Andoh, S. Kawahito
Shizuoka University, Hamamatsu, Japan
Toyota Central R&D Labs, Aichi, Japan
A CMOS image sensor for spatial optical communication is presented. A two-transistor optical communication cell with a depleted photodiode and lateral charge overflow drain improves the light pulse response. A weighed summation of 9-point parallel analog outputs and pulse equalizing technique greatly enhance the bit-rate and communication distance up to 10Mb/s and 70m, respectively.
Samsung and Yonsei University present fast low noise sensor with sigma-delta column-parallel ADC:
A 2.1Mpixel 120frame/s CMOS Image Sensor with Column-Parallel ΔΣ ADC Architecture
Y. Chae, J. Cheon, S. Lim, D. Lee, M. Kwon, K. Yoo, W. Jung, D-H. Lee, S. Ham, G. Han
Yonsei University, Seoul, Korea
Samsung Electronics, Yongin, Korea
A 2.1Mpixel 120frame/s CMOS image sensor with column-parallel ΔΣ ADCs is realized in a 0.13μm CMOS process. Column-parallel ΔΣ ADC architectures improve the conversion speed while reducing the random noise level as well. Inverter-based SC circuits maximize the power efficiency. This sensor achieves a measured noise floor of 1.9e-, while dissipating 180mW.
Another interesting paper from Samsung touts "Pseudo-Multiple Sampling" to achieve very low noise:
A 1.1e- Temporal Noise 1/3.2-inch 8Mpixel CMOS Image Sensor using Pseudo-Multiple Sampling
Y. Lim, K. Koh, K. Kim, H. Yang, J. Kim, Y. Jeong, S. Lee, H. Lee, S-H. Lim, Y. Han, J. Kim,
J. Yun, S. Ham, Y-T. Lee
Samsung Electronics, Yongin, Korea
A pseudo-multiple sampling technique for a low-noise CIS is implemented using a conventional column-parallel single-slope ADC structure with no additional circuitry. It is applied to a 1/3.2-inch 8Mpixel CIS. Measurement results show the technique effectively reduces dark temporal noise from 1.6e- to 1.2e- in 10b ADC mode, and from 1.8e- to 1.1e- in 12b ADC mode.
Shuzuoka University presentas HDR sensor with global shutter:
A 2.7e- Temporal Noise 99.7% Shutter Efficiency 92dB Dynamic Range CMOS Image Sensor with Dual Global Shutter Pixels
K. Yasutomi, S. Itoh, S. Kawahito
Shizuoka University, Hamamatsu, Japan
A dual global shutter CIS with pinned storage diode and floating diffusion memory enables a low noise level of 2.7e- and wide dynamic range of 92dB. Dual doping pinned diodes with a shielding structure attain a high shutter efficiency of 99.7%.
Austrian Institute of Technology presents even wider DR sensor:
A QVGA 143dB Dynamic Range Asynchronous Address-Event PWM Dynamic Image Sensor with Lossless Pixel-Level Video Compression
C. Posch, D. Matolin, R. Wohlgenannt
Austrian Institute of Technology, Vienna, Austria
A 0.18μm CIS contains a QVGA array of autonomous pixels that individually detect illumination changes and communicate new gray levels that are PWM encoded after each detected change, ideally realizing optimal lossless pixel-level video compression. Readout is frame-free 18b parallel AER. SNR of >56dB and intra-scene DRs of 143dB static and 125dB at 30fps equivalent have been achieved.
14MP CIS Orders from Japan to Grow
Digitimes reports that Aptina and OmniVision are expected to enjoy growing orders from Japan during 2010, as Japanese camera makers enhancing their hybrid camera offering. Mainly 14MP sensors are to be used in these hybrid cameras. It's not clear why Digitimes has not included Samsung 14MP product in its speculations.
Mediatek Adopts EDoF for 3G Camera-Phones
Digitimes reports that Mediatek adopts EDoF-enabled sensors for its Chinese-market 3G handset IC solutions since the first half of 2009. EDoF image sensors are expected to become more popular in the global handset market in 2010 because EDoF module prices are about US$3 lower than AF modules, according to Digitimes' sources.
Digitimes sources think that EDoF image sensors will be the first choice for cameraphones with 3MP or higher resolutions in the future, and 8MP cameraphones will become the mainstream in 2-3 years from now.
Digitimes sources think that EDoF image sensors will be the first choice for cameraphones with 3MP or higher resolutions in the future, and 8MP cameraphones will become the mainstream in 2-3 years from now.
Albert Theuwissen on TED Special Issue on Image Sensors
Albert Theuwissen published his impressions from November's IEEE Transactions on Electron Devices Special Issue on Image Sensors, along with memories from the previous special issues.
PMD Got Frost & Sullivan European Enabling Technology Award
Yahoo: The Frost & Sullivan '2009 European Real-Time 3D Imaging Enabling Technology Innovation Award' is presented to PMDTechnologies GmbH (PMDTec). "Photonic mixer device (PMD) technology developed by PMDTechnologies GmbH has opened up opportunities to develop three-dimensional imaging devices that are low cost, complex and robust," notes Frost & Sullivan.
IFM Electronics GmbH, specializing in the industrial automation sensing, has included in its product offerings the 3D camera developed in cooperation with PMDTechnologies and provides this solution to about 80,000 customers worldwide. In co-operation with Audi and Volkswagen, PMDTechnologies is already in the pre-fabrication stage of 3D sensors for automotive applications. Moreover, with other partners, the company is also developing solutions for medical, security & surveillance, and gaming application areas.
Currently, PMDTechnologies is working on 0.18-micron CMOS technology integration. Such an approach would lead to the creation of even smaller 3D imaging devices which could be available at lower cost. The company envisions such a camera for below $30 soon. Such performance at this price point has not been achieved using other 3D approaches, e.g. fringe projection based 3D vision systems, so far [Questionable claim - ISW].
IFM Electronics GmbH, specializing in the industrial automation sensing, has included in its product offerings the 3D camera developed in cooperation with PMDTechnologies and provides this solution to about 80,000 customers worldwide. In co-operation with Audi and Volkswagen, PMDTechnologies is already in the pre-fabrication stage of 3D sensors for automotive applications. Moreover, with other partners, the company is also developing solutions for medical, security & surveillance, and gaming application areas.
Currently, PMDTechnologies is working on 0.18-micron CMOS technology integration. Such an approach would lead to the creation of even smaller 3D imaging devices which could be available at lower cost. The company envisions such a camera for below $30 soon. Such performance at this price point has not been achieved using other 3D approaches, e.g. fringe projection based 3D vision systems, so far [Questionable claim - ISW].
Aptina Plans Production in Japan, Taiwan
Digitimes quotes Aptina CEO David Orton saying that Aptina plans to use Micron's 8-inch fab in Japan as its image sensor production site due to too many short lead-time orders from clients. Monthly capacity at the 8-inch fab in Japan is about 40,000 wafers, about the same as its 8-inch fab in Italy. The two 8-inch fabs will migrate to a 90nm process in the future, said Orton.
Greg Helton, president and managing director of Aptina Japan, noted that building closer relationships with customers is one of the reasons for using the fab in Japan since customers Canon, Nikon, Sony and Panasonic are all Japan-based.
Aptina will also consider using fabs in Taiwan for manufacturing some of its CIS products in the future, Orton added.
Greg Helton, president and managing director of Aptina Japan, noted that building closer relationships with customers is one of the reasons for using the fab in Japan since customers Canon, Nikon, Sony and Panasonic are all Japan-based.
Aptina will also consider using fabs in Taiwan for manufacturing some of its CIS products in the future, Orton added.
Live Lens Expands Sensor's DR
Australian TV has a piece about LiveLens, a patented ‘active’ electro-optical filter providing a WDR solution for cameras. The LiveLens combines liquid crystal on silicon (LCoS) technology with image sensor, where the liquid crystal controls its local transparency based on the local illumination level at the sensor plane. A picture from the company site explains the idea:
Live Technologies, the company behind LiveLens idea, has manufactured an 1MP prototype sensor on X-FAB. Then the liquid crystal assembly was done at Liquid Crystal Institute Advanced Materials Department, Kent State University, Ohio. Now the company demos WDR imaging results on its web site. The company has US patent 5,953,082 on its technology.
Live Technologies, the company behind LiveLens idea, has manufactured an 1MP prototype sensor on X-FAB. Then the liquid crystal assembly was done at Liquid Crystal Institute Advanced Materials Department, Kent State University, Ohio. Now the company demos WDR imaging results on its web site. The company has US patent 5,953,082 on its technology.
Aptina Picks Silicon Frontline Parasitics Extractor
Yahoo: Silicon Frontline Technology, an EDA company in the post-layout verification market, announced today that Aptina is using Silicon Frontline's F3D (Fast 3D) software for post-layout verification and for fast 3D extraction to improve Aptina's image sensor design accuracy and manufacturing quality.
By using Silicon Frontline's F3D software, Aptina's designers are optimizing floating diffusion capacitance, inter-pixel coupling, color-filter effects, impact of metal fill and signal channel mismatch.
By using Silicon Frontline's F3D software, Aptina's designers are optimizing floating diffusion capacitance, inter-pixel coupling, color-filter effects, impact of metal fill and signal channel mismatch.
Want to Earn $50 for Your Image Sensor Knowledge?
Electronic Design Magazine conducts Image Sensor Quiz, sponsored by Toshiba. All the participants are eligible to win one of six $50 Amazon certificate, so hurry up!
To me this looks like Toshiba likes to collect the contact details of people involved in image sensor activity. (Toshiba employees are not eligible for the gift certificate, naturally.)
Thanks to N. E. for letting me know.
To me this looks like Toshiba likes to collect the contact details of people involved in image sensor activity. (Toshiba employees are not eligible for the gift certificate, naturally.)
Thanks to N. E. for letting me know.
Raytheon Licenses Ziptronix 3D Interconnect Technology
Military and Aerospace Electronics: Raytheon Vision Systems is licensing the Ziptronix direct bond interconnect (DBI) technology in focal plane array technology for air, space and terrestrial image sensor applications. Ziptronix DBI technology provides 3D integration of multilayer CMOS structures within the focal plane.
Pixim Announces New Design Wins
Yahoo: Pixim announced that major security equipment manufacturers Cisco, GE Security, Siemens Building Technologies, Rainbow, Clinton Electronics, deView, Wren, Digimerge and Innotech are adding new Pixim-powered cameras to their line up.
Hynix and SETi First Public High-Profile Design Wins
Digitimes reports that Omnivision lost VGA sensor slot in HP low-priced notebooks to Hynix and SETi. This appears to be the first publicly announced high-profile design wins for the two Korean companies. They won by undercutting Omnivision's price, according to Digitimes' sources.
Samsung also won Asustek design slots over Omnivision, based on lower pricing. However, Samsung sensors are reported to be in short supply, so Asustek got back to Omnivision. Lower pricing could help Omnivision to regain lost design slots, according to Digitimes.
Samsung also won Asustek design slots over Omnivision, based on lower pricing. However, Samsung sensors are reported to be in short supply, so Asustek got back to Omnivision. Lower pricing could help Omnivision to regain lost design slots, according to Digitimes.
Bryce Bayer Got UK Royal Photographic Society Progress Award
Yahoo: Retired Kodak research scientist Bryce Bayer, whose invention of a color filter array enabled digital imaging sensors to capture color, is honored by the Royal Photographic Society with its Progress Award at a ceremony in London.
Bayer invented the color filter array that bears his name (the Bayer filter), which is incorporated into nearly every digital camera and camera phone on the market today. Described in U.S. Patent 3,971,065, “Color Imaging Array,” filed in 1975, color filters are arranged in a checkerboard pattern to best match how people perceive images, and provide a highly detailed color image.
Bayer invented the color filter array that bears his name (the Bayer filter), which is incorporated into nearly every digital camera and camera phone on the market today. Described in U.S. Patent 3,971,065, “Color Imaging Array,” filed in 1975, color filters are arranged in a checkerboard pattern to best match how people perceive images, and provide a highly detailed color image.
Sony Announces 3.3MP Sensor for Industrial Applications
Sony announced 2.5um pixel based fast frame rate sensor family for industrial applications. The new 3.27MP 1/2.8-inch IMX036LQR/LLR CMOS sensor family has color and B&W sensor versions. Sony uses “Exmor” brand for them which is a name for CMOS sensor with high-speed processing, low noise and low power column-parallel A/D conversion.
The sensors provide HD Video in 1080p format at 60fps speed at 10b ADC resolution or 30fps at 12b. At full 3.27MP resolution mode the sensors deliver 60fps rate at 10b or 15fps at 12b. 2x2 and 3x3 addition modes are supported. No power consumption number is given.
The sensors provide HD Video in 1080p format at 60fps speed at 10b ADC resolution or 30fps at 12b. At full 3.27MP resolution mode the sensors deliver 60fps rate at 10b or 15fps at 12b. 2x2 and 3x3 addition modes are supported. No power consumption number is given.
e2v Layoffs
Le Figaro (in French) reported that e2v announced its intention to eliminate 221 jobs, or nearly 50% of its workforce at its site in Saint-Egrève, near Grenoble. Bought in 2006 from Atmel, San Egrève site manufactures semiconductors for medical imaging, equipment and aircraft and employs 462 people. "The activity of semiconductors remains strong but we have suffered several setbacks including the dental medical imaging," the HR Director Philippe Fourcade Prat said. According to the union CFE-CGC and CFDT, the layoffs are mainly affecting the technicians of the company.
The planned layoffs and restructuring information has been circulating for few weeks already. UK Business Weekly reported that in the last 12 months, in particular since December 2008, e2v has seen a progressive weakening in demand across some of its commercial and industrial market sectors and in its medical market sector. Sales for the six months ended 30 September 2009 was down on the previous year at £96m (H1 2008/9: £107m) and pretax profit dropped to £2.6m (H1 2008/9: £3.1m).
e2v, which has some 1,700 staff, has already reduced headcount by over 130 staff in the last six months, reduced hours in the UK and USA, extended summer closure of the facility in Grenoble, France and closed its long range ‘Biosensors’ program in June 2009, just 10 months after its relaunch.
Having also decided to suspend its acquisition program and not pay an interim dividend for the 2009/10 year, e2v will also completely restructure its French operation and close down its Lincoln, UK manufacturing site.
In Grenoble, France, the company intends to refocus the operations associated with the imaging devices division around a fabless CMOS business model, complementing activity to the CCD-focused imaging operations in the UK.
In Lincoln, UK, where e2v has 160 employees, the company will close manufacturing activities and consolidate them at other UK sites, though the company says it is eager to keep key engineering and design jobs going and may create an engineering center in the city. Further restructuring may also take place at its Chelmsford, UK headquarters.
Thanks to T.B. for the information!
The planned layoffs and restructuring information has been circulating for few weeks already. UK Business Weekly reported that in the last 12 months, in particular since December 2008, e2v has seen a progressive weakening in demand across some of its commercial and industrial market sectors and in its medical market sector. Sales for the six months ended 30 September 2009 was down on the previous year at £96m (H1 2008/9: £107m) and pretax profit dropped to £2.6m (H1 2008/9: £3.1m).
e2v, which has some 1,700 staff, has already reduced headcount by over 130 staff in the last six months, reduced hours in the UK and USA, extended summer closure of the facility in Grenoble, France and closed its long range ‘Biosensors’ program in June 2009, just 10 months after its relaunch.
Having also decided to suspend its acquisition program and not pay an interim dividend for the 2009/10 year, e2v will also completely restructure its French operation and close down its Lincoln, UK manufacturing site.
In Grenoble, France, the company intends to refocus the operations associated with the imaging devices division around a fabless CMOS business model, complementing activity to the CCD-focused imaging operations in the UK.
In Lincoln, UK, where e2v has 160 employees, the company will close manufacturing activities and consolidate them at other UK sites, though the company says it is eager to keep key engineering and design jobs going and may create an engineering center in the city. Further restructuring may also take place at its Chelmsford, UK headquarters.
Thanks to T.B. for the information!
Delft University Sensors and Imaging Symposium
Delft University holds Sensors and Imaging: A VLSI Design Perspective Symposium on December 7, 2009. Some notable papers to be presented are:
Orly Yadid-Pecht
University of Calgary, Canada
"Advances in a CMOS Image Sensor based miniature fluorsence Detection System for Biosensing Applications"
Albert Theuwissen
Faculty of EEMCS, TU Delft
"State-of-the-art and future perspectives of Back-Side Illumination"
David Stoppa
Fondazione Bruno Kessler FBK-IRST, Italy
"Pixel Architectures for Time-Resolved Imaging Applications"
Robert Henderson
University of Edinburgh, U.K.
"A 32x32 Parallel Time-correlated Single Photon Counting Array in 130nm CMOS Technology"
Thanks to A.T. for sending me the info.
Orly Yadid-Pecht
University of Calgary, Canada
"Advances in a CMOS Image Sensor based miniature fluorsence Detection System for Biosensing Applications"
Albert Theuwissen
Faculty of EEMCS, TU Delft
"State-of-the-art and future perspectives of Back-Side Illumination"
David Stoppa
Fondazione Bruno Kessler FBK-IRST, Italy
"Pixel Architectures for Time-Resolved Imaging Applications"
Robert Henderson
University of Edinburgh, U.K.
"A 32x32 Parallel Time-correlated Single Photon Counting Array in 130nm CMOS Technology"
Thanks to A.T. for sending me the info.
Image Sensor Content at Electronic Imaging Conference
The annual Electronic Imaging Conference to be held on January 17-21 in San Jose has many image sensor related papers. Just to name a few out of many:
Fairchild Imaging presents its sCMOS sensor:
Wide dynamic range low light level CMOS Iimage sensor (Invited Paper)
Authors: Boyd A. Fowler, Xinqiao Liu, Stephen W. Mims, Janusz Balicki, Wang Li, Hung Do, Paul Vu, Fairchild Imaging
Abstract:
In this paper we present a CMOS image sensor technology suitable for the next generation of scientific cameras. We describe a 5.5Mpixel device based on this technology. The sensor features 5T pixels with pinned photodiodes on a 6.5um pitch. Each pixel also includes an integrated micro-lens. The 5T pixel architecture enables both rolling and global shutter operation. The measured peak quantum efficiency of the sensor is greater than 60% at 550nm, and the read noise is less than 1.5e- RMS at room temperature. The linear full well capacity is greater than 35ke-, the dark current is less than 3.8pA/cm2 at 20°C, and the MTF at 77 lp/mm is 0.4 at 600nm. The sensor also achieves an intra-scene linear dynamic range of greater than 87dB (23000:1) at room temperature.
This sensor has on-chip dual column level amplifiers and 11 bit single slope analog to digital converters (ADC) for high speed readout and wide optical dynamic range. The dual column level amplifier/ADC pairs have independent gain settings, and the final image is reconstructed by combining pixel readings from both the high and low gain readout channels to achieve a wide intra-scene dynamic range. The bandwidths of the column level amplifiers are programmable to optimize the sensor read noise for the selected sensor frame rate. The sensor can be readout in either rolling shutter or global shutter mode. The sensor can operate up to a line rate of 9us or a frame rate of 100Hz. The high speed digital readout electronics allow pixels to be scanned out at up to 290MHz.
Eliminating crosstalk in vertically integrated CMOS image sensors
Authors: Orit Skorka, Tyler Lucas, Dileepan Joseph, Univ. of Alberta (Canada)
Abstract:
Image sensors can benefit from 3D IC fabrication methods because photodetectors and electronic circuits may be fabricated using significantly different processes. When fabricating the tier that contains the photodetectors, it is desirable to avoid pixel level patterning of the light sensitive semiconductor. But without a physical border between adjacent photodetectors, lateral currents may flow between neighboring devices, which is called ''crosstalk''. These currents degrade the image quality because photo-generated charge carriers are sometimes collected in the ''wrong'' pixels. In this work, we present a method to reduce crosstalk in unpatterned photodetectors for vertically-integrated (VI) CMOS image sensors. Through feedback control of the electric potential at vertical interconnects, the crosstalk becomes negligible under normal imaging conditions. By maintaining a vertical electric field throughout the photodetector of sufficient uniformity and magnitude, lateral currents due to drift and diffusion are buried in the read noise. We illustrate the general method using the specific example of a VI-CMOS image sensor fabricated by flip-chip bonding a glass die with photodetectors to a CMOS die with active pixel sensor (APS) circuits. We present a logarithmic APS design with feedback control, which can be used to maintain an appropriate and suitably constant potential at the flip chip bonds. Simulation results are shown for a 0.18um CMOS process.
Kodak presents its W-RGB filter integrated onto CCD:
Improved sensitivity high-definition interline CCD using the Kodak TRUESENSE color filter pattern
Authors: James A. DiBella, Eastman Kodak Co. (United States); Marco Andreghetti, Kodak Japan Ltd. (Japan); Amy Enge, Eastman Kodak Co (United States); Doug A. Carpenter, Eastman Kodak Co. (United States); William Chen, Kodak (China) Ltd. (China)
NHK updates its organic photodiode state of the art:
Stacked color image sensor using wavelength-selective organic photoconductive films with zinc-oxide thin film transistors as a signal readout circuit
Author(s): Hokuto Seo, Satoshi Aihara, NHK Science & Technical Research Labs. (Japan); Masakazu Namba, Toshihisa Watabe, Hiroshi Ohtake, Misao Kubota, Norifumi Egami, NHK Science & Technology Research Labs. (Japan); Takahiro Hiramatsu, Tokiyoshi Matsuda, Mamoru Furuta, Hiroshi Nitta, Takashi Hirao, Kochi Univ. of Technology (Japan)
Abstract:
Our group has been developing a new type of image sensor overlaid with three organic photoconductive films, which are individually sensitive to only one of the primary color components (blue (B), green (G), or red (R) light), with the aim of developing a compact, high resolution color camera without the color separation optical systems used in current color cameras.
In this paper, we firstly revealed the unique characteristics of organic photoconductive films. Only choosing organic materials can tune photoconductive properties of the film, especially excellent wavelength selectivities which are good enough to divide the incident light into three primary colors. High-resolution of the organic photoconductive film sufficient for high-definition TV was also confirmed by shooting experiment using a camera tube. Secondly, as a step toward our goal, we fabricated a stacked organic image sensor with G- and R-sensitive organic photoconductive films, each of which had a readout circuit of zinc oxide (ZnO)- thin film transistor (TFT), and demonstrated the image pickup at a TV frame rate. A color image with a resolution corresponding to the pixel number of ZnO-TFT was obtained from the stacked image sensor, clearly indicating that color separation can be achieved using vertically stacked organic films.
Edoardo Charbon's group presents experimental results from its "Gigavision" sensor (the one that appears to be similar to Eric Fossum Digital Jot idea):
On pixel detection threshold in the gigavision camera
Author(s): Feng Yang, Ecole Polytechnique Fédérale de Lausanne (Switzerland); Luciano Sbaiz, Google Zurich (Switzerland); Edoardo Charbon, Technische Univ. Delft (Netherlands); Sabine Süsstrunk, Martin Vetterli, Ecole Polytechnique Fédérale de Lausanne (France)
Abstract:
Recently, we have proposed a new image device called gigavision camera whose most important characteristic is that pixels have binary response. The response function of a gigavision sensor is non-linear and similar to a logarithmic function, which makes the camera suitable for high dynamic range imaging. One important parameter in the gigavision camera is the threshold for generating binary pixels. Threshold T relates to the number of photo-electrons necessary for the pixel output to switch from "0" to "1". In this paper, a theoretical analysis of the influence of threshold in the gigavision camera is studied. If the threshold in the gigavision sensor is large, there will be a "dead zone" in the response function of a gigavision sensor. A method of adding artificial light is proposed to solve the "dead zone" problem. Through theoretical analysis and experimental results based on synthesized images, we show that for high light intensity, the gigavision camera with a large threshold and added light works better than one with unity threshold. Experimental results with a prototype camera based on a single photon avalanche diodes (SPAD) camera are also shown.
Fairchild Imaging presents its sCMOS sensor:
Wide dynamic range low light level CMOS Iimage sensor (Invited Paper)
Authors: Boyd A. Fowler, Xinqiao Liu, Stephen W. Mims, Janusz Balicki, Wang Li, Hung Do, Paul Vu, Fairchild Imaging
Abstract:
In this paper we present a CMOS image sensor technology suitable for the next generation of scientific cameras. We describe a 5.5Mpixel device based on this technology. The sensor features 5T pixels with pinned photodiodes on a 6.5um pitch. Each pixel also includes an integrated micro-lens. The 5T pixel architecture enables both rolling and global shutter operation. The measured peak quantum efficiency of the sensor is greater than 60% at 550nm, and the read noise is less than 1.5e- RMS at room temperature. The linear full well capacity is greater than 35ke-, the dark current is less than 3.8pA/cm2 at 20°C, and the MTF at 77 lp/mm is 0.4 at 600nm. The sensor also achieves an intra-scene linear dynamic range of greater than 87dB (23000:1) at room temperature.
This sensor has on-chip dual column level amplifiers and 11 bit single slope analog to digital converters (ADC) for high speed readout and wide optical dynamic range. The dual column level amplifier/ADC pairs have independent gain settings, and the final image is reconstructed by combining pixel readings from both the high and low gain readout channels to achieve a wide intra-scene dynamic range. The bandwidths of the column level amplifiers are programmable to optimize the sensor read noise for the selected sensor frame rate. The sensor can be readout in either rolling shutter or global shutter mode. The sensor can operate up to a line rate of 9us or a frame rate of 100Hz. The high speed digital readout electronics allow pixels to be scanned out at up to 290MHz.
Eliminating crosstalk in vertically integrated CMOS image sensors
Authors: Orit Skorka, Tyler Lucas, Dileepan Joseph, Univ. of Alberta (Canada)
Abstract:
Image sensors can benefit from 3D IC fabrication methods because photodetectors and electronic circuits may be fabricated using significantly different processes. When fabricating the tier that contains the photodetectors, it is desirable to avoid pixel level patterning of the light sensitive semiconductor. But without a physical border between adjacent photodetectors, lateral currents may flow between neighboring devices, which is called ''crosstalk''. These currents degrade the image quality because photo-generated charge carriers are sometimes collected in the ''wrong'' pixels. In this work, we present a method to reduce crosstalk in unpatterned photodetectors for vertically-integrated (VI) CMOS image sensors. Through feedback control of the electric potential at vertical interconnects, the crosstalk becomes negligible under normal imaging conditions. By maintaining a vertical electric field throughout the photodetector of sufficient uniformity and magnitude, lateral currents due to drift and diffusion are buried in the read noise. We illustrate the general method using the specific example of a VI-CMOS image sensor fabricated by flip-chip bonding a glass die with photodetectors to a CMOS die with active pixel sensor (APS) circuits. We present a logarithmic APS design with feedback control, which can be used to maintain an appropriate and suitably constant potential at the flip chip bonds. Simulation results are shown for a 0.18um CMOS process.
Kodak presents its W-RGB filter integrated onto CCD:
Improved sensitivity high-definition interline CCD using the Kodak TRUESENSE color filter pattern
Authors: James A. DiBella, Eastman Kodak Co. (United States); Marco Andreghetti, Kodak Japan Ltd. (Japan); Amy Enge, Eastman Kodak Co (United States); Doug A. Carpenter, Eastman Kodak Co. (United States); William Chen, Kodak (China) Ltd. (China)
NHK updates its organic photodiode state of the art:
Stacked color image sensor using wavelength-selective organic photoconductive films with zinc-oxide thin film transistors as a signal readout circuit
Author(s): Hokuto Seo, Satoshi Aihara, NHK Science & Technical Research Labs. (Japan); Masakazu Namba, Toshihisa Watabe, Hiroshi Ohtake, Misao Kubota, Norifumi Egami, NHK Science & Technology Research Labs. (Japan); Takahiro Hiramatsu, Tokiyoshi Matsuda, Mamoru Furuta, Hiroshi Nitta, Takashi Hirao, Kochi Univ. of Technology (Japan)
Abstract:
Our group has been developing a new type of image sensor overlaid with three organic photoconductive films, which are individually sensitive to only one of the primary color components (blue (B), green (G), or red (R) light), with the aim of developing a compact, high resolution color camera without the color separation optical systems used in current color cameras.
In this paper, we firstly revealed the unique characteristics of organic photoconductive films. Only choosing organic materials can tune photoconductive properties of the film, especially excellent wavelength selectivities which are good enough to divide the incident light into three primary colors. High-resolution of the organic photoconductive film sufficient for high-definition TV was also confirmed by shooting experiment using a camera tube. Secondly, as a step toward our goal, we fabricated a stacked organic image sensor with G- and R-sensitive organic photoconductive films, each of which had a readout circuit of zinc oxide (ZnO)- thin film transistor (TFT), and demonstrated the image pickup at a TV frame rate. A color image with a resolution corresponding to the pixel number of ZnO-TFT was obtained from the stacked image sensor, clearly indicating that color separation can be achieved using vertically stacked organic films.
Edoardo Charbon's group presents experimental results from its "Gigavision" sensor (the one that appears to be similar to Eric Fossum Digital Jot idea):
On pixel detection threshold in the gigavision camera
Author(s): Feng Yang, Ecole Polytechnique Fédérale de Lausanne (Switzerland); Luciano Sbaiz, Google Zurich (Switzerland); Edoardo Charbon, Technische Univ. Delft (Netherlands); Sabine Süsstrunk, Martin Vetterli, Ecole Polytechnique Fédérale de Lausanne (France)
Abstract:
Recently, we have proposed a new image device called gigavision camera whose most important characteristic is that pixels have binary response. The response function of a gigavision sensor is non-linear and similar to a logarithmic function, which makes the camera suitable for high dynamic range imaging. One important parameter in the gigavision camera is the threshold for generating binary pixels. Threshold T relates to the number of photo-electrons necessary for the pixel output to switch from "0" to "1". In this paper, a theoretical analysis of the influence of threshold in the gigavision camera is studied. If the threshold in the gigavision sensor is large, there will be a "dead zone" in the response function of a gigavision sensor. A method of adding artificial light is proposed to solve the "dead zone" problem. Through theoretical analysis and experimental results based on synthesized images, we show that for high light intensity, the gigavision camera with a large threshold and added light works better than one with unity threshold. Experimental results with a prototype camera based on a single photon avalanche diodes (SPAD) camera are also shown.
Don Scansen Presentation On-Line
Don Scansen has published a version of his IntertechPira Image Sensors 2009 presentation on his SemiconDr site. Quite interesting market intelligence and analysis info! For example, this is the market share pie for 2008 (I suppose there should be "two-thirds" in the right hand side statement):
Tessera Wins I3A VISION 2020 Award
Yahoo: I3A (International Imaging Industry Association) announced the winners of its new awards program, the VISION 2020 Imaging Innovation Awards.
Tessera won the Silver Award for its demonstrator of a wireless “smart” camera module in a toy. The demonstrator includes a VGA wafer-level camera that integrates the company’s wafer-level optics and image sensor packaging, face and smile detection technologies. Combined, these technologies enable the toy to detect multiple faces and provide appropriate responses, from making happy sounds when a new face appears, to laughing when a face smiles.
Tessera won the Silver Award for its demonstrator of a wireless “smart” camera module in a toy. The demonstrator includes a VGA wafer-level camera that integrates the company’s wafer-level optics and image sensor packaging, face and smile detection technologies. Combined, these technologies enable the toy to detect multiple faces and provide appropriate responses, from making happy sounds when a new face appears, to laughing when a face smiles.
Dexela Launches Sensitive Large Area X-Ray Imagers
Dexela introduces a family of large area flat panel CMOS X-ray detectors based on an innovative CMOS sensor design that combines fast speed and superior image quality.
The Dexela detector family’s main components are: CMOS image sensor, scintillator (structured CsI or Gadox), control electronics, readout electronics and communications with the workstation.
The Dexela CMOS image sensor consists of a photodiode array with a pixel size of 75µm. The sensor has very low dark current and read noise, with high linearity and consistency of response. A range of models is offered with the model number based on the active area: 1207 (115mm x 65mm), 1512 (145mm x 115mm), 2315 (230mm x 145mm), 2321 (230mm x 210mm), 2923 (290mm x 230mm), and 2923MAM (290mm x 230mm). The detector is capable of multi-resolution readout with dynamically adjustable binning at 1x2, 2x2, 1x4, 2x4 and 4x4. For the largest model in the range, the frame rate ranges from 26fps at full resolution (75µm) to 86fps binned 4x4 (300µm pixel pitch) over the whole active area of 29cm x 23cm.
The high fill factor, efficiency and low noise of the sensor combine to produce a high DQE of 0.70 at a skin dose of only 280µGy. This results in lower patient dose and said to be superior in image quality when compared to TFT-based detectors with significantly lower DQE.
Previously Dexela told that its X-ray image sensors are the largest commercially avaliable ones and are composed of tiled CMOS dice.
The Dexela detector family’s main components are: CMOS image sensor, scintillator (structured CsI or Gadox), control electronics, readout electronics and communications with the workstation.
The Dexela CMOS image sensor consists of a photodiode array with a pixel size of 75µm. The sensor has very low dark current and read noise, with high linearity and consistency of response. A range of models is offered with the model number based on the active area: 1207 (115mm x 65mm), 1512 (145mm x 115mm), 2315 (230mm x 145mm), 2321 (230mm x 210mm), 2923 (290mm x 230mm), and 2923MAM (290mm x 230mm). The detector is capable of multi-resolution readout with dynamically adjustable binning at 1x2, 2x2, 1x4, 2x4 and 4x4. For the largest model in the range, the frame rate ranges from 26fps at full resolution (75µm) to 86fps binned 4x4 (300µm pixel pitch) over the whole active area of 29cm x 23cm.
The high fill factor, efficiency and low noise of the sensor combine to produce a high DQE of 0.70 at a skin dose of only 280µGy. This results in lower patient dose and said to be superior in image quality when compared to TFT-based detectors with significantly lower DQE.
Previously Dexela told that its X-ray image sensors are the largest commercially avaliable ones and are composed of tiled CMOS dice.
Aptina Announces 14MP 1.4um Pixel-Based Sensor
Yahoo: Aptina launched MT9F001 - 14MP, 1.4um-pixel based sensor. The new sensor is able to capture 1080p/60fps HD video using four-lane HiSPi (High Speed Serial Pixel Interface) serial data interface.
Aptina A-Pix technology is claimed to overcome the challenge of effective photon collection in the photodiodes that small pixels present when using conventional FSI approach. The result achieved with Aptina’s technology is said to be BSI-equivalent in terms of sensitivity, but with less crosstalk for lower noise and more accurate color reproduction.
Aptina A-Pix technology is claimed to overcome the challenge of effective photon collection in the photodiodes that small pixels present when using conventional FSI approach. The result achieved with Aptina’s technology is said to be BSI-equivalent in terms of sensitivity, but with less crosstalk for lower noise and more accurate color reproduction.
Keith Fife Multi-Aperture Papers Published
There are few more Keith Fife papers on multi-aperture imaging published on Keith's Stanford University page. One of them is "Design and Characterization of Submicron CCDs in CMOS" paper and presentation slides on IISW 2009. Also, Keith's PhD Thesis "Devices for Integrated Multi-Aperture Imaging" from June 2009 is now on-line.
Pixim Won Homeland Security Award
Pixim's Digital Pixel System Technology won Best All Digital Technology from GSN: Government Security News during the 1st Annual Homeland Security Awards Ceremony.
Cypress Announces Sensors in Space
Business Wire: Cypress announced three of its state-of-the-art CMOS Image Sensors for space applications are on-board the European Space Agency’s (ESA) Proba-2 Satellite, which was launched on November 2. Cypress’s new HAS2 image sensor, specially designed for high accuracy star tracking, is implemented on a new Star Tracker developed by SELEX Galileo of Italy. The HAS2 image sensor is also being used in an extreme-ultraviolet telescope scientific experiment for solar corona observation. Additionally, Cypress’s STAR-250 image sensor is used on a new Digital Sun Sensor developed by TNO of the Netherlands. Both the HAS2 and STAR-250 devices were developed for the ESA by Cypress’s Image Sensor Business Unit in Belgium.
HAS2 image sensor has an array of 1024 x 1024 active pixels (18 µm) and supports on-chip Non-Destructive Readout and multiple windowing. STAR-250 sensor was originally developed for an optical inter satellite link. Currently it is mainly used for sun sensor applications. The device has an array of 512 x 512 pixels (25 µm).
HAS2 image sensor has an array of 1024 x 1024 active pixels (18 µm) and supports on-chip Non-Destructive Readout and multiple windowing. STAR-250 sensor was originally developed for an optical inter satellite link. Currently it is mainly used for sun sensor applications. The device has an array of 512 x 512 pixels (25 µm).
Cypress Announces 1.3MP Sensor for Machine Vision
Yahoo: Cypress announced 1.3MP VITA 1300 sensor combining a pipelined and triggered global shutter with a frame rate of 150fps. The 1/2-inch sensor is based on 4.8um pixels. It has four 10-bit LVDS outputs with a programmable offset and gain amplifier for each channel of the LVDS outputs. Each channel runs at a 620Mbps. An alternative data output is available through a single 10-bit parallel CMOS data output, operating at 62Msps. Extended optical dynamic range can be achieved by setting multiple slopes.
Samples of the VITA 1300 image sensor are expected to be available in February 2010, with production devices expected in the fourth quarter of 2010.
Samples of the VITA 1300 image sensor are expected to be available in February 2010, with production devices expected in the fourth quarter of 2010.
Aptina Announces WDR Sensor for Surveillance
FinanzNachrichten, Business Wire: Aptina announced MT9M033 surveillance image sensor combining wide dynamic range and HD. The new 1.2MP sensor is capable to run at 720p/60fps for HD video. There is no word on pixel size or any other pixel performance information. From the PR it's not clear how WDR mode is implemented.
The MT9M033 is sampling this quarter. Production is in Q1 2010.
The MT9M033 is sampling this quarter. Production is in Q1 2010.
Sharp Image Sensor Sales to Improve
Sharp announced that its CCD/CMOS sensors sales for the last 6 months ended on Sep. 30 have declined by 7.4% vs same period a year ago. However, the company is pretty optimistic about its yearly results, predicting 10.5% growth. The image sensor sales are expected to reach 90B Yen in its fiscal year ending on March 31, 2010 (see the bottom of the last page in the company report).
Kodak Combines W-RGB Filter with CCD
DCViews: The first public demonstration of CCD-based Kodak Truesense technology integration will be shown at Kodak's exhibit at the Vision 2009 trade show held November 3 - 5 in Stuttgart, Germany. The demonstration is based on the currently available 1080p format KAI-02150 Image Sensor combined with TRUESENSE Color Filter Pattern adding panchromatic, or “clear“ pixels to the red, green, and blue elements that form the image sensor array. Kodak claims a 2x to 4x increase in light sensitivity (from one to two photographic stops) compared to a standard Bayer color sensor.
Update: Here is the official Kodak PR.
Update: Here is the official Kodak PR.
Omnivision Improves Its VGA Sensor
Yahoo: Omnivision introduced its OV7675 VGA sensor to deliver optimized performance at a competitive cost for the high-volume OEMs developing mobile handsets for Indian and Chinese markets.
The 1/9-inch OV7675 uses 2.5um OmniPixel3-HS pixel with sensitivity of 1800 mV/lux-sec, significantly reduced noise and improved color reproduction. The OV7675 SOC sensor offers the full functionality of a complete VGA (640x480) camera, and is capable of operating at 30fps in full resolution. Its small form factor offers easy design integration for 6.5 mm x 6.5 mm drop-in replacement of VGA modules in existing handset designs.
The OV7675 comes in OmniVision's lead-free CSP3 packaging and is currently shipping in high volume quantities.
The 1/9-inch OV7675 uses 2.5um OmniPixel3-HS pixel with sensitivity of 1800 mV/lux-sec, significantly reduced noise and improved color reproduction. The OV7675 SOC sensor offers the full functionality of a complete VGA (640x480) camera, and is capable of operating at 30fps in full resolution. Its small form factor offers easy design integration for 6.5 mm x 6.5 mm drop-in replacement of VGA modules in existing handset designs.
The OV7675 comes in OmniVision's lead-free CSP3 packaging and is currently shipping in high volume quantities.
Panavision Sues Omnivision, Aptina, Canon
I missed this news item at the time, so thanks to R.C. for bringing this to my attention:
From OVTI 10-Q form, July 2009:
On March 6, 2009, Panavision Imaging, LLC, or Panavision, filed a complaint against [OVTI] alleging patent infringement in the District Court for the Central District of California. The case is entitled Panavision Imaging, LLC v. OmniVision Technologies, Inc., Canon U.S.A., Inc., Micron Technology, Inc. and Aptina Imaging Corporation, Case No. CV09-1577. In its complaint, Panavision asserts that we make, have made, use, sell and/or import products that infringe U.S. Patent Nos. 6,818,877 (“Pre-charging a Wide Analog Bus for CMOS Image Sensors”), 6,633,029 (“Video Bus for High Speed Multi-resolution Imagers and Method Thereof”) and 7,057,150 (“Solid State Imager with Reduced Number of Transistors per Pixel”). The complaint seeks unspecified monetary damages, fees and expenses and injunctive relief against us. We expect to vigorously defend ourselves against Panavision’s allegations. The Court has scheduled a claim construction hearing for December 10, 2009.
From OVTI 10-Q form, July 2009:
On March 6, 2009, Panavision Imaging, LLC, or Panavision, filed a complaint against [OVTI] alleging patent infringement in the District Court for the Central District of California. The case is entitled Panavision Imaging, LLC v. OmniVision Technologies, Inc., Canon U.S.A., Inc., Micron Technology, Inc. and Aptina Imaging Corporation, Case No. CV09-1577. In its complaint, Panavision asserts that we make, have made, use, sell and/or import products that infringe U.S. Patent Nos. 6,818,877 (“Pre-charging a Wide Analog Bus for CMOS Image Sensors”), 6,633,029 (“Video Bus for High Speed Multi-resolution Imagers and Method Thereof”) and 7,057,150 (“Solid State Imager with Reduced Number of Transistors per Pixel”). The complaint seeks unspecified monetary damages, fees and expenses and injunctive relief against us. We expect to vigorously defend ourselves against Panavision’s allegations. The Court has scheduled a claim construction hearing for December 10, 2009.
Intertech-Pira Image Sensors 2009 Presentations On-Line
Here used to be a link to the presentations from the recent Intertech-Pira Image Sensors 2009 conference (San Diego Oct. 13-16). A lot of interesting stuff!
[Update: The links have been removed at request from the originator. This link was supposed to be only for attendees of the conference, not for the general public.]
On the technical side, Don Scansen shows Chipworks reverse engineering picture of Omnivision BSI packaging scheme:
There is one more Chipworks BSI sensor picture, apparently of Sony ClearVid camcorder sensor:
Don also presents many other observations, some of them quite paradoxical. One of the graphs shows that Microsoft has filed about 10 patent applications on BSI technology. Personally, I have not seen any of them.
Another interesting presentation comes from DxO Labs on camera module self calibration. It presents very nice features but no word is said about the price to implement them in silicon - an important omission. Also, Gr/Gb imbalance section excessively downplays the alternative approaches to the problem.
On the marketing side, there is an interesting presentation by Sanyo on digital camera market, product trends and adoption rates. Toshiba presentation mainly talks about the market consolidation trend. The Strategies Unlimited presentation disappointed me a bit, as its many data labels from the charts are removed - looks like a teaser for the paid reports.
[Update: The links have been removed at request from the originator. This link was supposed to be only for attendees of the conference, not for the general public.]
On the technical side, Don Scansen shows Chipworks reverse engineering picture of Omnivision BSI packaging scheme:
Another interesting presentation comes from DxO Labs on camera module self calibration. It presents very nice features but no word is said about the price to implement them in silicon - an important omission. Also, Gr/Gb imbalance section excessively downplays the alternative approaches to the problem.
On the marketing side, there is an interesting presentation by Sanyo on digital camera market, product trends and adoption rates. Toshiba presentation mainly talks about the market consolidation trend. The Strategies Unlimited presentation disappointed me a bit, as its many data labels from the charts are removed - looks like a teaser for the paid reports.
Toshiba Announces Its First BSI Sensor
Toshiba announces its first BSI sensor. The 1/2.3-inch 14.6MP sensor is targeted to DSC and camera phones with video capability. The sensor is based on 1.4um pixels. Its video frame rate is 60fps at 1080p and 720p formats.
BSI approach is said to boost "light sensitivity and absorption by 40% compared to existing Toshiba products". Given already excellent QE numbers of Toshiba FSI sensors, I wonder how they can be improved by so much.
Sampling of the new sensor will begin in December and mass production will follow from the third quarter of 2010 (July—September). The new sensor will be produced at Toshiba's Oita Operations 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.
Toshiba will continue to develop BSI products as a mainstream technology. CMOS image sensors are a focus product of Toshiba's System LSI business. Until now, their main application has been in mobile phones. With the new BSI sensors, Toshiba plans to expand their applications to include digital cameras.
BSI approach is said to boost "light sensitivity and absorption by 40% compared to existing Toshiba products". Given already excellent QE numbers of Toshiba FSI sensors, I wonder how they can be improved by so much.
Sampling of the new sensor will begin in December and mass production will follow from the third quarter of 2010 (July—September). The new sensor will be produced at Toshiba's Oita Operations 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.
Toshiba will continue to develop BSI products as a mainstream technology. CMOS image sensors are a focus product of Toshiba's System LSI business. Until now, their main application has been in mobile phones. With the new BSI sensors, Toshiba plans to expand their applications to include digital cameras.
Nanya Enters CIS Production?
Digitimes reports that Nanya has been in talks with Aptina, Himax, Omnivision and Pixart for the possible release of foundry orders. Nanya is looking to maximize the utilization of its two 8-inch fabs by manufacturing image sensors.
Digitimes reminds that Powerchip and ProMOS have both stepped into CIS production at 8-inch fabs, both not very successful. ProMOS has been rumored to cease its image sensor activities, while Powerchip reportedly produces a small fraction of Omnivision products.
Digitimes reminds that Powerchip and ProMOS have both stepped into CIS production at 8-inch fabs, both not very successful. ProMOS has been rumored to cease its image sensor activities, while Powerchip reportedly produces a small fraction of Omnivision products.
Omnivision Sensors in Tight Supply
Digitimes: OmniVision has notified its customers to expect limited supply of its image sensors due to strong iPhone 3GS demand for the end-year holiday season, according to Digitimes' sources. Tight supply is not expected to ease until late November 2009.
Apple has increased Q4 orders for the iPhone 3GS to its Taiwan-based manufacturing partners Foxconn and Primax by 17-20%, noted the sources. Notebook vendors are gearing up to introduce new models following the launch of Windows 7 which will also tighten the supply of CIS, the sources added.
Apple has increased Q4 orders for the iPhone 3GS to its Taiwan-based manufacturing partners Foxconn and Primax by 17-20%, noted the sources. Notebook vendors are gearing up to introduce new models following the launch of Windows 7 which will also tighten the supply of CIS, the sources added.
Canesta Raises $16M, Quanta Joins Investment Round
Yahoo, VentureBeat: Canesta announced it has raised $16M in additional capitalization. Joining returning investors Carlyle Growth Partners, Hotung Venture Group, and Venrock are two new strategic investors – Quanta Computer, the world’s largest manufacturer of notebook computers, and SMSC, a mixed-signal ICs vendor.
“The emergence of 3-D ‘natural’ interfaces in PCs – such as ‘touchless’ gesture controls – as well as other immersive applications, has been inevitable,” commented Jim Spare president and CEO of Canesta. “The implied endorsement and strong interest in 3-D imaging technology by the world’s largest personal computer ODM will encourage other players to adopt this game-changing technology,” said Spare.
In February this year, Hitachi and Canesta demonstrated a television with 3-D interface and natural “gesture-based” controls (ISW link).
Some of the applications made possible by Canesta’s 3-D electronic perception chips and technology include:
Update: SMSC has invested $2M in Canesta. SMSC and Canesta have agreed to collaborate in the definition of 3-D camera solutions whereby SMSC can combine its connectivity technologies and systems expertise with Canesta 3-D sensor devices and software to accelerate the adoption of this technology. The two companies intend to create economic, integrated solutions to add 3-dimensional depth-perception to automotive, PC, TV, consumer electronics and other communications devices.
“The emergence of 3-D ‘natural’ interfaces in PCs – such as ‘touchless’ gesture controls – as well as other immersive applications, has been inevitable,” commented Jim Spare president and CEO of Canesta. “The implied endorsement and strong interest in 3-D imaging technology by the world’s largest personal computer ODM will encourage other players to adopt this game-changing technology,” said Spare.
In February this year, Hitachi and Canesta demonstrated a television with 3-D interface and natural “gesture-based” controls (ISW link).
Some of the applications made possible by Canesta’s 3-D electronic perception chips and technology include:
- Hands-free gesture control (for new user experiences that are more convenient and “fun”);
- Robust and accurate facial recognition for user identification and security;
- Background substitution for video conferencing and “virtual sets” (to enable every consumer to have video conferencing and content-creation capabilities that are currently only available to professionals with large budgets);
- Avatar control for 3-D virtual communities (increasing ease-of-use and improving accessibility to a wider audience);
- Augmented reality;
- Immersive personalized advertising;
Update: SMSC has invested $2M in Canesta. SMSC and Canesta have agreed to collaborate in the definition of 3-D camera solutions whereby SMSC can combine its connectivity technologies and systems expertise with Canesta 3-D sensor devices and software to accelerate the adoption of this technology. The two companies intend to create economic, integrated solutions to add 3-dimensional depth-perception to automotive, PC, TV, consumer electronics and other communications devices.
Tessera CSP Offers Proven Reliability
Electronic Design published Tessera team article describing reliability challenges with many TSV processes, while proposing Tessera CSP solution as a proven alternative.
CMOSIS Uses Tower Process for its First Standard Product
Yahoo: CMOSIS disclosed that it uses Tower 0.18um process for its first off-the-shelf sensor CMV2000. CMOSIS selected Tower’s 0.18um process for its aggressive layout rules, allowing a novel pixel structure featuring a pixel size of 5.5µm x 5.5µm which is needed to stay close to a 2/3" optical format with 2.2M pixel resolution and form factor. The CMV2000 combines a pipelined global shutter operation that allows true correlated double sampling and a full-frame rate of 300fps.
CMOSIS estimates its target machine vision sensor market at ~$200M (CCD and CMOS combined).
CMOSIS estimates its target machine vision sensor market at ~$200M (CCD and CMOS combined).
Accolade Drops Aptina IP Lawsuit
Law360: Accolade has dismissed the claims of patent infringement against Aptina.
More about Nobel CCD Controversy
IEEE Spectrum put a special page with collection of articles and podcast about the controversy around the CCD invention in Bell Labs.
HDcctv Alliance Got SMPTE License
Yahoo: HDcctv Alliance receives the security industry's first license to SMPTE HD-SDI Standards, bringing the HDTV digital technology for video delivery over coaxial cable to the HDcctv Specification. The HDcctv Alliance members include CSST, Gennum, Stretch, AltaSens, blueCaps, Comart, COP UK, EverFocus, theHDcctv.com, OmniVision, Ovii, and Pixim.
ST Announces 5MP EDoF Sensor Family
Yahoo: ST unveiled its new 5MP CMOS image sensors family based on 1.4um pixels. The 1/4-inch sensors are based on 65/45nm process and said to utilize ST's unique pixel-isolation techniques to maximize the sensor's SNR.
The sensors allow 5MP cameras within dimensions of 6.5 x 6.5mm and a low module height of typically 5mm to enable ultra-low-profile handset designs. From the announcement it's not clear if EDoF and ISP are integrated onto the sensor die or they are separate. It appears that ST prepares a large product family with different types of integration and feature sets, including EDoF and AF VCM drivers.
All the sensors will include single-line or dual-line 1GHz Camera Serial Interface (CSI-2), as defined by the Mobile Industry Processor Interface (MIPI) alliance, and the 650Mbit/s Compact Camera Port (CCP2) interface defined by the Standard Mobile Imaging Architecture (SMIA) group.
ST will offer standard-die and Through-Silicon Via (TSV) packaging in the 5MP family. The standard packaging will support cameras combining Chip-On-Board (COB) sensor connection and discrete optical components. TSV enables emerging technologies such as Wafer-Level Camera (WLC).
Engineering samples of the first of these sensors are available now, and the roadmap will continue with new product introductions throughout the remainder of 2009.
Reportedly these ST's 45/65nm based FSI pixels deliver better QE and SNR10 performance than BSI. This presents a problem for Omnivision to justify the added BSI complexity.
The sensors allow 5MP cameras within dimensions of 6.5 x 6.5mm and a low module height of typically 5mm to enable ultra-low-profile handset designs. From the announcement it's not clear if EDoF and ISP are integrated onto the sensor die or they are separate. It appears that ST prepares a large product family with different types of integration and feature sets, including EDoF and AF VCM drivers.
All the sensors will include single-line or dual-line 1GHz Camera Serial Interface (CSI-2), as defined by the Mobile Industry Processor Interface (MIPI) alliance, and the 650Mbit/s Compact Camera Port (CCP2) interface defined by the Standard Mobile Imaging Architecture (SMIA) group.
ST will offer standard-die and Through-Silicon Via (TSV) packaging in the 5MP family. The standard packaging will support cameras combining Chip-On-Board (COB) sensor connection and discrete optical components. TSV enables emerging technologies such as Wafer-Level Camera (WLC).
Engineering samples of the first of these sensors are available now, and the roadmap will continue with new product introductions throughout the remainder of 2009.
Reportedly these ST's 45/65nm based FSI pixels deliver better QE and SNR10 performance than BSI. This presents a problem for Omnivision to justify the added BSI complexity.
Stanford HDR Symposium Materials
Stanford University held Symposium and Workshop on High Dynamic Range Imaging in September 2009. The selected presentations form this event are available on-line.
Thanks to S.S. for sharing the link!
Thanks to S.S. for sharing the link!
Does CCD Idea Really Belong to Smith and Boyle?
IEEE Spectrum Tech Talk blog has two posts questioning Smith’s and Boyle's ownership of the CCD idea (Post #1, Post #2 with comments). The posts suggest that the idea originally came from their Bell Labs collegue Eugene Gordon.
Thanks to E.F. for sending me the link.
Update: As said in comments, there is another post saying that the CCD idea originator is Michael F. Tompsett.
Thanks to E.F. for sending me the link.
Update: As said in comments, there is another post saying that the CCD idea originator is Michael F. Tompsett.
Fast Pixel Shutter Imaging Unveiled
The Engineer Online: UK Oxford University researchers presented Fast Pixel Shutter Imaging (FPSI) technology. They demonstrated the technology using a prototype built out of a digital micro-mirror array comprising a vast amount of individually moveable mirrors measuring 10um each. The mirrors can be toggled on and off and used as pixel-level optical switches. So each pixel gets individually controlled exposure.
Oxford group is working with researchers at Nottingham University on fashioning the technology into a single CMOS chip that could be integrated into small electronic devices, including mobile phones. Within six months they plan to unveil a mobile-phone-sized camera that can demonstrate FPSI.
Oxford group is working with researchers at Nottingham University on fashioning the technology into a single CMOS chip that could be integrated into small electronic devices, including mobile phones. Within six months they plan to unveil a mobile-phone-sized camera that can demonstrate FPSI.
DxO Lab Discloses Its Future Directions
In an interview with EE Times, Jérôme Meniere, chairman and CEO of DXO Labs, shrank the field of view and focused on DXO Labs' solutions for camera phones, and unveiled future research directions. DxO Labs also provides the calibration and tuning tools which allow the configuration of the ISP to be done more easily and at a lower cost.
Another marker of differentiation is DxO Labs' EDoF technology. DxO Labs said PalmPre smartphones and Nokia cell phones integrate its EDoF design.
Looking ahead, Meniere said he identifies several directions: "There are huge opportunities to help camera module manufacturers reduce their costs. The idea is to loosen some constraints that we recover and use at the image processing level. Typically, you can have a yield drop because the optic has been badly tuned. We can recover modules that otherwise would be thrown away, and here lies a huge gain."
Another direction concerns very high ISO, probably with associated noise reduction. Other possible directions were described in very general words, so I do not quote them.
DxO Labs, formerly known as DO Labs SA, was founded in 2002 as a spin-off of Vision IQ, a company in the field of computer vision. It currently employs about 100 people, including 60 percent in R&D, and has filed about 40 patent families.
Another marker of differentiation is DxO Labs' EDoF technology. DxO Labs said PalmPre smartphones and Nokia cell phones integrate its EDoF design.
Looking ahead, Meniere said he identifies several directions: "There are huge opportunities to help camera module manufacturers reduce their costs. The idea is to loosen some constraints that we recover and use at the image processing level. Typically, you can have a yield drop because the optic has been badly tuned. We can recover modules that otherwise would be thrown away, and here lies a huge gain."
Another direction concerns very high ISO, probably with associated noise reduction. Other possible directions were described in very general words, so I do not quote them.
DxO Labs, formerly known as DO Labs SA, was founded in 2002 as a spin-off of Vision IQ, a company in the field of computer vision. It currently employs about 100 people, including 60 percent in R&D, and has filed about 40 patent families.
KLA-Tencor Helps Toppan to Get 300mm Wafer Capability
Yahoo: KLA-Tencor announced that its 8900 defect inspection system was recently installed at the first 300mm advanced CFA fab of Toppan. Key features of the new 8900 defect inspection system include:
- Simultaneous brightfield and darkfield optical paths to capture a wide range of defect types in a single pass, such as micro-lens deformation; resist and fall-on defects; color contamination; large stains and striations;
- Selectable LED inspection and review illumination spectrum matched to CIS filter colors;
- Sensitivity consistent with requirements of advanced CIS roadmaps;
- Throughput above 110 wafers per hour at production sensitivity, for 300mm semiconductor wafers;
- Automated binning of defects by type;
- Automated sensor pass/fail dispositioning; and
- Automated color review for defect verification.
Invensense Targets OIS Systems
Electronic Design: Addressing lower-cost optical image stabilization (OIS) as a major goal, InvenSense has unveiled the first digital dual-axis pitch and roll (X and Y) gyroscope for camera phones and digital still cameras. The original announcement from over a month is here. The IDG-2000 family offers the smallest such devices on the market, housed in a 4- by 4- by 0.9-mm quad flat no-lead (QFN) package and integrating 16b ADcs. The IDG-2000 measures hand jitter across a wide frequency range of 0.1 Hz to 20 Hz with noise 0.033°/s-rms.
The 20Hz upper range looks too low to me, especially for zoom equipped cameras. However, it should work fine for wide angle low light situations.
The 20Hz upper range looks too low to me, especially for zoom equipped cameras. However, it should work fine for wide angle low light situations.
Silicon Image 18MP ISP IP Core
EETimes talks about new Silicon Image camerIC-18 ISP IP core targeted to camera phones with resolutions from 5MP to 18MP. Ron Richter, director of business development at Silicon Image, tells all the nice stories about the new ISP capabilities while saying very little about small pixel-specific artifacts. I doubt that stand-alone ISP companies can survive in the small pixel times without a deep knowledge of this kind of stuff.
Update: Here is the official Silicon Image PR.
Update #2: EETAsia: Meanwhile TI has introduced two new members of its OMAP-DM5x family of coprocessors that claim to deliver 20MP capability and and 720p HD video functionality. The new OMAP-DM515 and OMAP-DM525 coprocessors offer 8MP shot-to-shot speed of 1.4fps in high-quality mode and 2fps in burst mode.
Update: Here is the official Silicon Image PR.
Update #2: EETAsia: Meanwhile TI has introduced two new members of its OMAP-DM5x family of coprocessors that claim to deliver 20MP capability and and 720p HD video functionality. The new OMAP-DM515 and OMAP-DM525 coprocessors offer 8MP shot-to-shot speed of 1.4fps in high-quality mode and 2fps in burst mode.
Tessera Hits and Misses
EETimes: In 2005, realizing that it needed a new engine for growth, Tessera has embarked on a bold but little-understood strategy that could pay huge dividends--or may simply fall flat. Since 2005, it has acquired five separate companies in the imaging and optics arena (Shellcase, Digital Optics, Eyesquad, FotoNation and Dblur). Call it Tessera's big gamble: It hopes to replicate success in DRAM IP, by assembling the pieces to boost the imaging quality and functionally for camera-based handsets.
But the company has already seen a slight setback for its Imaging and Optics division. Citing a fall in capital equipment spending, the Imaging and Optics group is projected to exit the year with about $12 million in sales for 2009, significantly down from $23 million in sales last year. The group missed its forecast in other respects. At one time, the Imaging and Optics division projected that its sales would hit $100 million by 2010. The group has now pushed out those ambitious $100 million sales targets to 2011.
The article also has few interesting side stories, such as wafer level camera status at ST:
With Nokia--ST's largest camera module customer--pushing for very low-cost modules and wafer level camera technology adoption, ST also began developing wafer level optics. In light of the challenges, checks suggest that the ST's wafer level camera was not reaching the same level of image quality, causing Nokia to become less aggressive in pushing its vendors to adopt a wafer level camera approach.
But the company has already seen a slight setback for its Imaging and Optics division. Citing a fall in capital equipment spending, the Imaging and Optics group is projected to exit the year with about $12 million in sales for 2009, significantly down from $23 million in sales last year. The group missed its forecast in other respects. At one time, the Imaging and Optics division projected that its sales would hit $100 million by 2010. The group has now pushed out those ambitious $100 million sales targets to 2011.
The article also has few interesting side stories, such as wafer level camera status at ST:
With Nokia--ST's largest camera module customer--pushing for very low-cost modules and wafer level camera technology adoption, ST also began developing wafer level optics. In light of the challenges, checks suggest that the ST's wafer level camera was not reaching the same level of image quality, causing Nokia to become less aggressive in pushing its vendors to adopt a wafer level camera approach.
iSuppli Forecasts 2B Sensors in 2012
Digitimes: iSupply predicts image sensor market to grow from 1.3B units in 2009 to more than 2B in 2012. Shipments of image sensors to the automotive market are expected to more than triple, rising from 4.2M in 2009 to 14.6M units in 2013. In 2010, more than one billion image sensors will be shipped to the handset market, iSuppli predicts.
Omnivision BSI Backside Implant Optimizations
Omnivision BSI pixel uses P+ backside implant to passivate the backside surface. The recently published WO/2009/099491 patent application gives some details of its optimization process. The figure below shows the location of the backside P+ implant 220:
First, Omnivision optimizes the P+ layer depth, making few implants with different energies:
The sensitivity for the different depths is shown below:
Next step is the optimization of the P+ implant dosage. The three tested dosages are shown here:
The pixel sensitivity vs dosage is shown below:
One more step is optimization of the silicon layer thickness:
First, Omnivision optimizes the P+ layer depth, making few implants with different energies:
Next step is the optimization of the P+ implant dosage. The three tested dosages are shown here:
The pixel sensitivity vs dosage is shown below:
Omnivision BSI Pixel Crosss-section Revealed
WIPO published Omnivision patent applications WO/2009/099778 and WO/2009/100039 on BSI photodiode profile and WO/2009/100038 on black pixels in BSI technology. While the black pixel idea is quite obvious - removing photodiode implants to make black pixel light-insensitive, a really interesting part of these applications is Omnivision BSI pixel cross-section:
One can see that the photodiode extends well underneath the transistor region. Apparently, Omnivision did a great job to achieve lag-free operation with such a complex shape of the fully depleted photodiode.
The earlier Omnivision BSI applications, such as WO/2009/099483, WO/2009/09949, WO/2009/099494, WO/2009/099491 do not mention the extended photodiode profile. By the way, the last of these has an interesting part describing optimizations of the backside implant and the sensor's substrate thickness.
One can see that the photodiode extends well underneath the transistor region. Apparently, Omnivision did a great job to achieve lag-free operation with such a complex shape of the fully depleted photodiode.
The earlier Omnivision BSI applications, such as WO/2009/099483, WO/2009/09949, WO/2009/099494, WO/2009/099491 do not mention the extended photodiode profile. By the way, the last of these has an interesting part describing optimizations of the backside implant and the sensor's substrate thickness.
More about Sony Single-Lens 3D Approach
Tech-On: Sony single-lens 3D camera is based on the concept that it is possible to achieve enough stereoscopic and depth effects with an interocular distance of several millimeters. The concept, which is called "microstereopsis," was announced in 1995.
There are two major advantages in using the new monocular video camera. First, it does not cause disagreement between the focal point of the eyes and the intersection point of the lines of sight (accommodation-vergence conflict), which is typical of normal 3D images. Second, though it requires special glasses to view 3D images, the images do not split into two even without the glasses.
Carnegie Mellon University group spent some time on microstereopsis principle research at the beginning of this decade. The approach relies on human vision perception psychology when surprisingly small disparities between left and right eyes are adequate to stimulate binocular stereopsis. So, even if the stereo base is much smaller than 6.5cm, typical for human eye-to-eye distance, a good 3D perception can be achieved.
There are two major advantages in using the new monocular video camera. First, it does not cause disagreement between the focal point of the eyes and the intersection point of the lines of sight (accommodation-vergence conflict), which is typical of normal 3D images. Second, though it requires special glasses to view 3D images, the images do not split into two even without the glasses.
Carnegie Mellon University group spent some time on microstereopsis principle research at the beginning of this decade. The approach relies on human vision perception psychology when surprisingly small disparities between left and right eyes are adequate to stimulate binocular stereopsis. So, even if the stereo base is much smaller than 6.5cm, typical for human eye-to-eye distance, a good 3D perception can be achieved.
Albert Theuwissen on CCD Nobel Prize
Albert Theuwissen publishes a nice blog post on CCDs in our personal and professional lives.
8,188 SPADs Integrated
EETimes: Philips Research group integrated 8,188 single-photon avalanche detectors (SPAD) on a single die so that each SPAD is individually addressable. The Philips chip is a digital design with an integrated 8ps timer. It does not need a separate digital readout ASIC today's analog SPAD arrays require.
Philips engineers hope to use the chip as a block in a larger 8x8 array they plan to prototype by the end of the year. Such arrays could be used in medical PET scanners, new automotive night vision systems or high throughput DNA testers.
Philips engineers hope to use the chip as a block in a larger 8x8 array they plan to prototype by the end of the year. Such arrays could be used in medical PET scanners, new automotive night vision systems or high throughput DNA testers.
Gigavision Sensor Proposed
New Scientist: A team led by Edoardo Charbon, a professor from the Swiss Federal Polytechnic Institute (EPFL) in Lausanne presented their so-called "gigavision" sensor at an OMNIVIS 2009 workshop on Oct. 4 in Kyoto, Japan.
While Charbon's idea is new and has a patent pending, the principle behind it is not. It has long been known that memory chips are extremely sensitive to light. The charge stored in every cell corresponds to whether that cell is in a light or dark area. Memory cell is small, so for every pixel on one of today's sensors, the memory-based sensor could have 100 pixels. A chip the size of a 10MP camera sensor will have 100 times as many sensing cells if implemented in memory technology - hence the choice of the gigavision name.
Unlike the pixels in a conventional sensor, which record a greyscale, the cells in Charbon's memory-chip sensor are simple on-off devices: they can only store a digital 0 or 1, for which read either light or dark. To build a sensor that can record shades of grey, EPFL engineer Feng Yang, who presented the Kyoto paper, is developing a software algorithm that looks across an array of 100 pixels to estimate their overall greyscale value.
On the surface this sounds a lot like Eric Fossum's Digital Jot idea. Once EPFL patent application is published, one can see what is the difference. I'm almost sure that EPFL team is aware of the prior art and did something different.
Comments to the New Scientist article point that using of RAMs as sensors is known since 70s, so this part of the work is hardly new.
While Charbon's idea is new and has a patent pending, the principle behind it is not. It has long been known that memory chips are extremely sensitive to light. The charge stored in every cell corresponds to whether that cell is in a light or dark area. Memory cell is small, so for every pixel on one of today's sensors, the memory-based sensor could have 100 pixels. A chip the size of a 10MP camera sensor will have 100 times as many sensing cells if implemented in memory technology - hence the choice of the gigavision name.
Unlike the pixels in a conventional sensor, which record a greyscale, the cells in Charbon's memory-chip sensor are simple on-off devices: they can only store a digital 0 or 1, for which read either light or dark. To build a sensor that can record shades of grey, EPFL engineer Feng Yang, who presented the Kyoto paper, is developing a software algorithm that looks across an array of 100 pixels to estimate their overall greyscale value.
On the surface this sounds a lot like Eric Fossum's Digital Jot idea. Once EPFL patent application is published, one can see what is the difference. I'm almost sure that EPFL team is aware of the prior art and did something different.
Comments to the New Scientist article point that using of RAMs as sensors is known since 70s, so this part of the work is hardly new.
HH NEC Buys Grace Semiconductor
EETimes: Image sensor foundry HH NEC merges with Grace Semiconductor (buys Grace according to another article). Grace also has some image sensor history, when Cypress unsuccessfully tried to transfer its image sensor process to Grace few years ago. Since then Grace reportedly abandoned its attempts in image sensor area. On the other hand, HH NEC has entered image senors recently.
Dongbu Officially Becomes CIS IDM
EETimes: At last week's GSA Expo Dongbu has quietly devised a CMOS image sensor and LCD driver IC that is being marketed under its own brand name. So, now Dongbu goes to compete with its own customers, such as SETi and Siliconfile.
Kodak Announces 4MP 32fps CCD
Kodak: The 4MP KAI-04050 CCD, based on 5.5um Interline Transfer Platform, sets a new benchmark for 1" optical format devices, featuring full resolution frame rate up to 32fps. A Region of Interest (ROI) mode supports partial readout at even higher frame rates, such as 3MP in a 16:9 aspect ratio at 40fps, or standard VGA at over 90 fps.
The KAI-04050 will be available in both color and monochrome configurations. Engineering grade devices are currently available, and production availability is planned for Q4, 2009.
Kodak PluggedIn blog talks about the whole 5.5um pixel family, which includes 5 CCDs now.
The KAI-04050 will be available in both color and monochrome configurations. Engineering grade devices are currently available, and production availability is planned for Q4, 2009.
Kodak PluggedIn blog talks about the whole 5.5um pixel family, which includes 5 CCDs now.
CCD Inventors Willard Boyle and George Smith Got Nobel Prize
Yahoo: CCD inventors Willard S. Boyle and George E. Smith shared the 2009 Nobel Prize in physics with the fiber optics inventor Charles K. Kao. The award's 10 million kronor ($1.4 million) purse will be split between the three with Kao taking half and Boyle and Smith each getting a fourth.
In its citation, the Royal Swedish Academy of Sciences said that Boyle and Smith "invented the first successful imaging technology using a digital sensor, a CCD."
Boyle, in a phone call to the academy, said he is reminded of his work with Smith "when I go around these days and see everybody using our little digital cameras, everywhere. Although they don't use exactly our CCD, it started it all."
He added that the biggest achievement resulting from his work was when images of Mars were transmitted back to Earth using digital cameras. "We saw for the first time the surface of Mars," Boyle said. "It wouldn't have been possible without our invention."
In its citation, the Royal Swedish Academy of Sciences said that Boyle and Smith "invented the first successful imaging technology using a digital sensor, a CCD."
Boyle, in a phone call to the academy, said he is reminded of his work with Smith "when I go around these days and see everybody using our little digital cameras, everywhere. Although they don't use exactly our CCD, it started it all."
He added that the biggest achievement resulting from his work was when images of Mars were transmitted back to Earth using digital cameras. "We saw for the first time the surface of Mars," Boyle said. "It wouldn't have been possible without our invention."
EV Group Installs Fusion Wafer Bonders at Two Image Sensor Manufacturing Facilities in Asia
Yahoo: EV Group (EVG) announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI FB automated production fusion bonding systems will be employed for the production of BSI CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors.
Samsung Licenses Apical IP
Electronics Weekly: Samsung has licensed an image processing core from London-based IP developer Apical. Apical has developed Iridix imaging technology which provides local DR correction on per-pixel basis. The licensing agreement entitles Samsung LSI to integrate the latest version of Iridix into any of its semiconductor designs.
CMOSIS Comes Out with Off the Shelf Product
AZOM.com: Custom sensors design house CMOSIS has announced its first standard product. The 2.2MP CMV2000 imager is based on 5.5um pixel and designed to run at a frame rate of more than 300fps at full resolution. A unique feature of the CMV2000 is its novel pixel structure, which combines pipelined global shutter operation with CDS. This technique, pioneered by CMOSIS, yields a low noise level below 18 e-.
The CMV2000 integrates a high-performance 10bit column ADC on-chip. The ADC features a slow 12bit mode and multiple HDR modes.
Samples of the CMV2000 are currently released to certain CMOSIS customers. Full production will ramp up in early 2010. A 4MP version of the new sensor, named CMV4000, will be available to camera manufacturers beginning May 2010.
The CMV2000 integrates a high-performance 10bit column ADC on-chip. The ADC features a slow 12bit mode and multiple HDR modes.
Samples of the CMV2000 are currently released to certain CMOSIS customers. Full production will ramp up in early 2010. A 4MP version of the new sensor, named CMV4000, will be available to camera manufacturers beginning May 2010.
Welcome New Imaging Technologies - A Smart Sensor Company
It came to my attention there is a new image sensor startup in France. New Imaging Technologies (NIT) is a fabless company providing both standard products, custom design and technology consulting-licensing. NIT is a spin-off from the French National Telecommunication Institute. Lead by Professor Yang NI, the research team has worked since 1991 on CMOS smart imaging devices for a large variety of scientific, industrial, automotive, biometrics and optical communications applications. Several tens of CMOS application oriented smart sensors have been designed and delivered.
The company has been granted with a R&D contract from the French Ministry of Defense through its DGA operation. NIT will design a specific CMOS imaging sensor using its proprietary wide dynamic range technology (so called MAGIC) to be coupled with an image intensifier for night vision application.
Also, NIT won a design contract with an unnamed major Japanese firm for designing a smart imaging sensor for mass market application. The sensor is said to use a 0,18um process from a large silicon foundry.
Thanks to J.B. for letting me know about the new startup.
The company has been granted with a R&D contract from the French Ministry of Defense through its DGA operation. NIT will design a specific CMOS imaging sensor using its proprietary wide dynamic range technology (so called MAGIC) to be coupled with an image intensifier for night vision application.
Also, NIT won a design contract with an unnamed major Japanese firm for designing a smart imaging sensor for mass market application. The sensor is said to use a 0,18um process from a large silicon foundry.
Thanks to J.B. for letting me know about the new startup.
Fujifilm Organic CMOS Sensor
MuTaka has brought to my attention a DPNet article in Chinese on organic image sensors - see comments to Tessera post. Unfortunately, I'm unable to understand most of the article, other than seeing that Fuji is making a good progress in the organic sensors.
Potentially, multi-layered organic sensors can over-perform BSI by a big margin. Their biggest advantage is that the dye absorption could be tuned to have very high QE in each of three colors, crosstalk can be minimized and each pixel location can detect and process all three color signals. Bayer sensors, on the other hand, get only one color per pixel, effectively discarding 2/3 of the incoming signal.
Said all this there are few challenges that organic sensors should overcome on their way to the mass market:
Potentially, multi-layered organic sensors can over-perform BSI by a big margin. Their biggest advantage is that the dye absorption could be tuned to have very high QE in each of three colors, crosstalk can be minimized and each pixel location can detect and process all three color signals. Bayer sensors, on the other hand, get only one color per pixel, effectively discarding 2/3 of the incoming signal.
Said all this there are few challenges that organic sensors should overcome on their way to the mass market:
- Process reproducibility and reliability. So far thin film organic photodiodes experience large variation, in comparison with silicon photodiodes.
- Large dark current, orders of magnitude higher than Si photodiodes of the same size
- Noise, primarily kTC noise. It appears that generic 4T pixel architecture used for kTC noise suppression is not applicable for organic sensors. Other techniques for the noise reduction should be developed for them.
Omnivision Wins Microsoft HD Webcam Design
Yahoo: Omnivision announced that its OV9712, a native 720p wide-screen HD video image sensor, was selected by Microsoft for its next generation webcam. The 1/4-inch OV9712 uses a 3-micron OmniPixel3-HS pixel architecture. The sensor supports 30fps speed.
Tessera One More Time Announces Face Reconition Technology
Yahoo: Tessera one more time announced its FotoNation FaceRecognition. Tessera acquired Fotonation at the beginning of 2008 for $29M (plus another $10M if some goals are met). By that time Fotonation already had face recognition product for sale.
I guess this announcement relates to an improvement version of it, although it's not clearly stated. The technology appears to be software based and available for a number of platforms, including COACH and ARM. No recognition speed or number of simultaneously recognized faces is mentioned, both being very important merits of the algorithm.
I guess this announcement relates to an improvement version of it, although it's not clearly stated. The technology appears to be software based and available for a number of platforms, including COACH and ARM. No recognition speed or number of simultaneously recognized faces is mentioned, both being very important merits of the algorithm.
Sony Goes 3D with Single Lens
Sony announced the development of a single lens 3D camera technology capable of recording 3D images of fast-moving subject matter such as sports, at 240fps. A prototype camera incorporating this technology is to be demonstrated at at "CEATEC JAPAN 2009" in Chiba city, Japan, from October 6.
In existing 3D camera systems have separate lenses for the left and right eyes. However, when operating the zoom and focus functions of such systems, a complex technology is required to ensure that each camera lens is closely coordinated, and there are no discrepancies in the optical axis, image size, and focus. The human eye is very sensitive to differences in the size and rotational movement of dual images, as well as any vertical misalignment or difference in image quality. The introduction of a single lens system is said to resolve any issues that may occur as a result of having different optical characteristics for each eye.
The optical scheme of the camera is shown below:
The main idea appears to be that the images from left and right sides of the single lens are split, so one sensor gets the image from the left half of the lens, while the other sensor gets the right half image.
It looks to me that Sony could make much more compact design on the same principle, if it used a single stereo image sensor, such as one described in a recent Kodak patent application US20090219432. Kodak relies on exotic lenticular microlens in this invention, but the same idea can be easily implemented with regular microlens, although the exact reference to this implementation escapes me.
Update: Kodak stereo sensor principle is illustrated below:
In existing 3D camera systems have separate lenses for the left and right eyes. However, when operating the zoom and focus functions of such systems, a complex technology is required to ensure that each camera lens is closely coordinated, and there are no discrepancies in the optical axis, image size, and focus. The human eye is very sensitive to differences in the size and rotational movement of dual images, as well as any vertical misalignment or difference in image quality. The introduction of a single lens system is said to resolve any issues that may occur as a result of having different optical characteristics for each eye.
The optical scheme of the camera is shown below:
The main idea appears to be that the images from left and right sides of the single lens are split, so one sensor gets the image from the left half of the lens, while the other sensor gets the right half image.
It looks to me that Sony could make much more compact design on the same principle, if it used a single stereo image sensor, such as one described in a recent Kodak patent application US20090219432. Kodak relies on exotic lenticular microlens in this invention, but the same idea can be easily implemented with regular microlens, although the exact reference to this implementation escapes me.
Update: Kodak stereo sensor principle is illustrated below:
Albert Theuwissen PTC Lessons: Temperature Influence
Albert Theuwissen published another chapter in the great series of articles on Photon Transfer Curve (PTC) measurements - the influence of temperature on PTC.
New Applications for Fast and High Resolution Sensors
MIT News reviewed MIT Graphics Group's article presented last week at IEEE Conference on Computer Vision in Kyoto, Japan. The idea is that given enough time, a digital camera could take a dozen photos with different focus distance and software could stitch them into a perfectly focused composite.
For the time being, however, the technique is limited by the speed of camera sensors. So, the group described alternative approach based on "lattice-focal lens," an ordinary lens filter with what look like 12 tiny boxes of different heights clustered at its center. Each box is in fact a lens with a different focal length, which projects an image onto a different part of the camera's sensor. The raw image would look like gobbledygook, but the same type of algorithm that can combine multiple exposures into a coherent composite can also recover a regular photo from the raw image.
More details and articles can be found on Sam Hasinoff page.
For the time being, however, the technique is limited by the speed of camera sensors. So, the group described alternative approach based on "lattice-focal lens," an ordinary lens filter with what look like 12 tiny boxes of different heights clustered at its center. Each box is in fact a lens with a different focal length, which projects an image onto a different part of the camera's sensor. The raw image would look like gobbledygook, but the same type of algorithm that can combine multiple exposures into a coherent composite can also recover a regular photo from the raw image.
More details and articles can be found on Sam Hasinoff page.
Micron Loss on Aptina Spin-Off Corrected to $41M
Micron has just announced its quarterly report with Aptina deal details. It appears that Micron's previously recorded $53M loss on Aptina sale is corrected to $41M now:
"On July 10, 2009, the company sold a 65% interest in Aptina Imaging Corporation (“Aptina”), a wholly-owned subsidiary of the company and a significant component of its Imaging segment, to Riverwood Capital (“Riverwood”) and TPG Capital (“TPG”). Under the agreement, the company received approximately $35 million in cash and retained a 35% minority stake in Aptina and Riverwood and TPG contributed significant debt-free capital to the independent, privately-held, company. In connection therewith, in the third quarter of fiscal 2009, the company recorded a charge of $53 million, the estimated loss on the transaction, to write down certain Aptina intangible assets and property, plant and equipment to their estimated fair values. The company’s results of operations for the fourth quarter of fiscal 2009 include a credit of $12 million to adjust the estimated loss to the final loss of $41 million. The company will account for its interest in Aptina under the equity method and will continue to manufacture products for Aptina under a wafer supply agreement."
"On July 10, 2009, the company sold a 65% interest in Aptina Imaging Corporation (“Aptina”), a wholly-owned subsidiary of the company and a significant component of its Imaging segment, to Riverwood Capital (“Riverwood”) and TPG Capital (“TPG”). Under the agreement, the company received approximately $35 million in cash and retained a 35% minority stake in Aptina and Riverwood and TPG contributed significant debt-free capital to the independent, privately-held, company. In connection therewith, in the third quarter of fiscal 2009, the company recorded a charge of $53 million, the estimated loss on the transaction, to write down certain Aptina intangible assets and property, plant and equipment to their estimated fair values. The company’s results of operations for the fourth quarter of fiscal 2009 include a credit of $12 million to adjust the estimated loss to the final loss of $41 million. The company will account for its interest in Aptina under the equity method and will continue to manufacture products for Aptina under a wafer supply agreement."
Visera and Xintec Chairman Gets Back to TSMC
Digitimes: Xintec and Visera chairman, Shang-Yi Chiang is getting back to TSMC as senior VP R&D. In the past Shang-Yi Chiang used to be TSMC's VP R&D, overseeing image sensor development, among many other things.
Update: EETimes adds few more details on Shang-Yi decisions to go from VP R&D to chairman and then back.
Update: EETimes adds few more details on Shang-Yi decisions to go from VP R&D to chairman and then back.
Omnivision Announces Design Win for its Small Footprint Sensor
Yahoo: OmniVision announced that its ultra small OV6920 medical image sensor has been selected for ETView's new TVT Tracheoscopic Ventilation Tube. The OV6920 is among the world's smallest available NTSC CMOS image sensors based on 2.5um pixels, enabling TVT camera outer diameter of just 4mm.
Jova Low Cost Image Sensor Tester
EETimes: Jova presents its new image sensor and module tester. The new ISL-3200 tester sells for as $9,995 in volume and supports up to 64MP resolution at 100MHz pixel rate. MIPI/SMIA interfaces are supported through an adapter board.
The new system represents the next generation of Jova's benchtop testers. The company customers include Aurora Optical, Boston Scientific, ExBiblio, HP, Imaging Works, MFlex, NASA, NoblePeak, OmniVision, Palm, Siimpel, TSMC, Tessera and Vista Point Technologies (Flextronics).
The new system represents the next generation of Jova's benchtop testers. The company customers include Aurora Optical, Boston Scientific, ExBiblio, HP, Imaging Works, MFlex, NASA, NoblePeak, OmniVision, Palm, Siimpel, TSMC, Tessera and Vista Point Technologies (Flextronics).
Taiwanese Camera Module Production to Grow
Yahoo: New Research and Markets report finds that the Taiwanese camera module industry's shipment continued to be affected by the global mobile phone market decline in the first half of 2009, with shipment falling year-on-year. In 2009, CCM shipments are expected to see year-on-year growth, as the global economy is starting to show signs of recovery and the emerging market demand is increasing.
JVC Demos 4K 60p Video Camera
At IBC2009, JVC provides a live demonstration of its KY-F4000 real-time 4K camera. Live 60p images from the KY-F4000 will be displayed on JVC’s new 56-inch LCD panel with 4K resolution in the Production Village area of IBC. This compact camera features a single 1.25-inch CMOS image sensor of 3840 x 2160 pixels, capable of producing live images with 4 times the resolution of full HD.
JVC is currently shipping a 4K D-ILA projector, the DLA-SH4K. The addition of a 4K camera and 4K LCD monitor brings full capture capability and further display options to its product line.
JVC is currently shipping a 4K D-ILA projector, the DLA-SH4K. The addition of a 4K camera and 4K LCD monitor brings full capture capability and further display options to its product line.
Project Natal Broadly Supported by Game Developers
Xbit Labs: At Tokyo Games Show Microsoft said that its forthcoming 3D image-sensing Natal device is supported by 14 major developers of video games. Among them are Activision Blizzard, Bethesda Softworks, Capcom, Disney Interactive, Electronic Arts, Konami, MTV Games, Namco Bandai, Sega, Square Enix, THQ, Ubisoft and, of course, Microsoft Game Studios.
Developers who received development kits from Microsoft in early June, used the opening of the Tokyo Game Show to voice their excitement about the device. Microsoft Project Natal device combines an RGB camera, depth sensor, multi-array microphone and custom processor. The depth sensor, which is an infrared projector combined with a monochrome CMOS sensor, allows Natal to see the room in 3D under any lighting conditions.
Update: Project Natal FAQ gives a lot more details, both technical and business.
Developers who received development kits from Microsoft in early June, used the opening of the Tokyo Game Show to voice their excitement about the device. Microsoft Project Natal device combines an RGB camera, depth sensor, multi-array microphone and custom processor. The depth sensor, which is an infrared projector combined with a monochrome CMOS sensor, allows Natal to see the room in 3D under any lighting conditions.
Update: Project Natal FAQ gives a lot more details, both technical and business.
HH NEC Reveals 0.162um CIS Process
Tech-On: Shanghai-based Hua Hong NEC announced production of CMOS image sensor in its 0.162µm process (CIS162). The 4T pixel process is derived from HH NEC standard 0.162µm logic process. The foundry is said to cooperate with its key customer to develop the CIS162 process with a 1.8V core device and 3.3V I/O circuits.
Galaxycore is rumored to be HH NEC's key customer [ISW].
Galaxycore is rumored to be HH NEC's key customer [ISW].
Samsung is Sampling HD Sensors
Digitimes: Samsung is sampling HD image sensors. The company expects HD and full HD sensors to enjoy significant growth in 2010. The penetration rate of 1.3MP sensors (both HD and non-HD) used in notebooks will increase to 43% in 2010 from 30% in 2009, and 2MP or above full-HD sensors will increase to 21% from 13%, according to Samsung.
Omnivision Outlook Improving
The Business Insider: Morgan Keegan upgraded OmniVision Technologies Inc. on Monday to its highest rating, saying the chip maker is taking market share from Aptina and is on track to increase profitability. Upgrades to image sensors in smartphones and laptops will improve profit margins, and the company has opportunities in the auto sector as well.
Barron's adds that according to the same analyst, Omnivision has weathered the downturn better than some of its rivals, and says it is “well-positioned in each of its end markets.”
Yahoo: In the meantime, Omnivision announced that its AutoVision image sensors have been selected by Altek, a Taiwanese imaging systems provider. Altek chose OmniVision's sensors for its Eagle View 360 degree surround viewer and lane departure warning system (LDWS), two of the automotive industry's most sought after driver assistance applications. Altek's Eagle View system is already being implemented by a large Asian automotive OEM.
Barron's adds that according to the same analyst, Omnivision has weathered the downturn better than some of its rivals, and says it is “well-positioned in each of its end markets.”
Yahoo: In the meantime, Omnivision announced that its AutoVision image sensors have been selected by Altek, a Taiwanese imaging systems provider. Altek chose OmniVision's sensors for its Eagle View 360 degree surround viewer and lane departure warning system (LDWS), two of the automotive industry's most sought after driver assistance applications. Altek's Eagle View system is already being implemented by a large Asian automotive OEM.
CAP-XX Studies Camera Phone Illuminator Options
While not directly coupled to image sensors, Australian capacitor vendor CAP-XX published a study of LED and Xenon flashes commonly found in mobile phones. As one can expect, LED power is lower than Xenon, but LED pulse lasts much longer:
Samsung Launches 1.4um Pixel Product
Market Watch: Samsung announced its newest quarter-inch optical format, 5MP SoC image sensor, the S5K4EA at the sixth annual Samsung Mobile Solutions Forum held in Taipei, Taiwan. Samsung’s proprietary pixel technology, the Samsung Enhanced Energy Steering (SEES) is said to bring more light into its 1.4um pixel. No word on BSI is said, so it's probably FSI sensor.
The S5K4EA imager has regionally adaptive DR expansion to brighten shadowed areas of a picture and is said to "intensify the clarity of brighter regions". Its fast frame capture with anti-shaking control feature enables sharp pictures by reducing blur caused by jitter from unsteady hands. The sensor is capable of processing 1080p resolution images at 30fps.
Samsung’s S5K4EA also offers auto focus, Xenon flash, mechanical or electronic rolling shutter. The new imager has a YUV output interface over MIPI2 or parallel. It also has JPEG with thumbnail output to speed up picture browsing on the phone.
The S5K4EA imager is available in an auto focus 8.5x8.5x6mm or smaller module. Ramples are currently available with mass production slated for the first quarter of 2010.
The S5K4EA imager has regionally adaptive DR expansion to brighten shadowed areas of a picture and is said to "intensify the clarity of brighter regions". Its fast frame capture with anti-shaking control feature enables sharp pictures by reducing blur caused by jitter from unsteady hands. The sensor is capable of processing 1080p resolution images at 30fps.
Samsung’s S5K4EA also offers auto focus, Xenon flash, mechanical or electronic rolling shutter. The new imager has a YUV output interface over MIPI2 or parallel. It also has JPEG with thumbnail output to speed up picture browsing on the phone.
The S5K4EA imager is available in an auto focus 8.5x8.5x6mm or smaller module. Ramples are currently available with mass production slated for the first quarter of 2010.
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