EV Group Installs Fusion Wafer Bonders at Two Image Sensor Manufacturing Facilities in Asia

Yahoo: EV Group (EVG) announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI FB automated production fusion bonding systems will be employed for the production of BSI CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors.

Samsung Licenses Apical IP

Electronics Weekly: Samsung has licensed an image processing core from London-based IP developer Apical. Apical has developed Iridix imaging technology which provides local DR correction on per-pixel basis. The licensing agreement entitles Samsung LSI to integrate the latest version of Iridix into any of its semiconductor designs.

CMOSIS Comes Out with Off the Shelf Product

AZOM.com: Custom sensors design house CMOSIS has announced its first standard product. The 2.2MP CMV2000 imager is based on 5.5um pixel and designed to run at a frame rate of more than 300fps at full resolution. A unique feature of the CMV2000 is its novel pixel structure, which combines pipelined global shutter operation with CDS. This technique, pioneered by CMOSIS, yields a low noise level below 18 e-.

The CMV2000 integrates a high-performance 10bit column ADC on-chip. The ADC features a slow 12bit mode and multiple HDR modes.

Samples of the CMV2000 are currently released to certain CMOSIS customers. Full production will ramp up in early 2010. A 4MP version of the new sensor, named CMV4000, will be available to camera manufacturers beginning May 2010.