Tessera Introduces a New Thinner Wafer-Level Chip-Size Packaging

Advanced Imaging Pro: Tessera Technologies announced SHELLCASE(R) RT, one of the world's thinnest, wafer-level chip size packaging (WLCSP). As one of the thinnest WLCSPs on the market today (at ~500microns), SHELLCASE(R) RT enables very low profile camera modules.